World Class Turn Key WLCSP Solution Provider




Internet of Things (IoT) and Cloud Computing






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Deliver test and full-turnkey for all semiconductor device types including: Logic, Mixed Signal, RF, Linear and Memory

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Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP, Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.

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Wide range of semiconductor packaging solutions: Leadframe, Laminate and Wafer Level Packages

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Packaging Capability
and Assembly Services

Build a sustainable business while providing value to our customers, partners, stakeholders and constituents

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Corporate Social

UTAC Global Footprint

UTAC has over 260,000 square metres of manufacturing footprint spanning across Singapore, Thailand, Indonesia, Malaysia and China.

We have sales offices and agents located in the United States, Europe, Middle East and Asia.

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