Find out more by clicking on any of the following.
Overview
Deliver test and full-turnkey for all semiconductor device types including: Logic, Mixed Signal, RF, Linear and Memory
For more information on our Test Solutions,

Test
Solutions
Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP, Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.
For more information on our Packaging Solutions,

Packaging
Solutions
Wide range of semiconductor packaging solutions: Leadframe, Laminate and Wafer Level Packages
For more information on our Packaging Capability and Assembly Services,

Packaging Capability
and Assembly Services
Build a sustainable business while providing value to our customers, partners, stakeholders and constituents
For more information on our Corporate Social Responsibility,

Corporate Social
Responsibility
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Rep Office
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Sales Office
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Factories


Fermont, CA

Phoenix, AZ

Austin, TX


Israel

Yantai, China

Shanghai, China

Jinshan, China

Taiwan

Dongguan, China

Thailand

Malaysia

Indonesia

South Korea

Japan

Singapore
UTAC Global Footprint
UTAC has over 260,000 square metres of manufacturing footprint spanning across Singapore, Thailand, Indonesia, Malaysia and China.
We have sales offices and agents located in the United States, Europe, Middle East and Asia.
For more information on our locations,