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UTAC is a leader in assembly and test services for diverse semiconductor devices
World Class Full Turn Key WLCSP Solution Provider
Internet of Things (IoT) and Cloud Computing
System Level Test Robot
End-of-Line Packing Automation
Deliver test and full-turnkey for all semiconductor device types including: Logic, Mixed Signal, RF, Linear and Memory
For more information on our Test Solutions,
Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP, Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.
For more information on our Packaging Solutions,
Wide range of semiconductor packaging solutions: Leadframe, Laminate and Wafer Level Packages
For more information on our Packaging Capability and Assembly Services,
and Assembly Services
Build a sustainable business while providing value to our customers, partners, stakeholders and constituents
For more information on our Corporate Social Responsibility,
- Rep Office
- Sales Office
UTAC Global Footprint
UTAC has over 260,000 square metres of manufacturing footprint spanning across Singapore, Thailand, Indonesia, Malaysia and China.
We have sales offices and agents located in the United States, Europe, Middle East and Asia.
For more information on our locations,