Automotive

 
 

5G

 
 

Internet of Things (IoT) and Cloud Computing

 
 

Analog

 
 

Power

Overview

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Deliver test and full-turnkey for all semiconductor device types including: Logic, Mixed Signal, RF, Linear and Memory

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Test
Solutions

Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP, Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.

For more information on our Packaging Solutions,

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Packaging
Solutions

Wide range of semiconductor packaging solutions: Leadframe, Laminate and Wafer Level Packages

For more information on our Packaging Capability and Assembly Services,

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Packaging Capability
and Assembly Services

Build a sustainable business while providing value to our customers, partners, stakeholders and constituents

For more information on our Corporate Social Responsibility,

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Corporate Social
Responsibility

UTAC Global Footprint

UTAC has over 260,000 square metres of manufacturing footprint spanning across Singapore, Thailand, Indonesia, Malaysia and China.

We have sales offices and agents located in the United States, Europe, Middle East and Asia.

For more information on our locations,

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