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UTAC is a leader in assembly and test services for diverse semiconductor devices
Internet of Things (IoT) and Cloud Computing
Deliver test and full-turnkey for all semiconductor device types including: Logic, Mixed Signal, RF, Linear and Memory
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Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP, Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.
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Wide range of semiconductor packaging solutions: Leadframe, Laminate and Wafer Level Packages
For more information on our Packaging Capability and Assembly Services,
and Assembly Services
Build a sustainable business while providing value to our customers, partners, stakeholders and constituents
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UTAC Global Footprint
UTAC has over 260,000 square metres of manufacturing footprint spanning across Singapore, Thailand, Indonesia, Malaysia, China and Taiwan.
We have sales offices and agents located in the United States, Europe, Middle East and Asia.
For more information on our locations,