16th Electronics Packaging Technology Conference (EPTC)

03 – 05 Dec 2014Marina Bay Sands, Singapore

  1. Unit Warpage Control with Universal Die Thickness Authors: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn
  2. Package Characterization of UTAC’s Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages Authors: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn


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