16th Electronics Packaging Technology Conference (EPTC)
03 – 05 Dec 2014
Marina Bay Sands, Singapore
- Unit Warpage Control with Universal Die Thickness Authors: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn
- Package Characterization of UTAC’s Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages Authors: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn
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