17th Electronics Packaging Technology Conference (EPTC 2015)

17th Electronics Packaging Technology Conference (EPTC 2015)

02 – 04 Dec 2015Marina Mandarin, Singapore

1. Process and Design Optimization of Lead-frame Packages for Molded Underfill Process Through Mold Flow Simulation
   Authors: Daniel Ting Lee Teh, Jun Dimaano, Preecha Joymak, Apinan Seetao, Kunawut Noisorn
2. The 1-up strip warpage control of lead frame package
   Authors: Gu Bin, Jun Dimaano, Seow Fui Shi, Dr Nathapong Suthiwongsunthorn
3. GaN packages’ performance study utilizing FEM Analysis and actual assembly build for validation
   Authors: Kyaw Ko Lwin, Jun Dimaano, T.L Teh Daniel, Carolyn E.T, Dr. Nathapong S, Saravuth S

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