banner-services2 Decapsulation

Failure Analysis Services

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Technique
  • Laser Decap method
Application

Laser Decap is a dry method of decapsulation, using a high-power laser to ablate the plastic encapsulant material away from a device. Laser decapsulation system is controlled with precision stepper motors to achieve more precise positioning than chemical etching. It is possible to decapsulate devices that would be exceptionally challenging to expose chemically (eg. Cu wire bond) and can do partial/selective decapsulation. If used in combination with chemical etching, yield rate can be greatly improved as contact time with chemicals is reduced.


Technique
  • Chemical Decap method
Application

Decapsulation is a step performed to expose the internal parts of the IC (dies and internal bonding) by removing a portion of mold compound area and depth in preparation for inspection, chemical analysis or electrical examination of the die and the internal features of the package. This is done without altering the IC's original electrical characteristics.

Decapsulation

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