banner-services2 Temperature Cycling (TC)|Temperature Cycling on Board (TCOB)

Reliability Services

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Test
Temperature Cycling (TC) Air to Air
Condition

JESD22-A104; Standard Conditions

  • -55ºC / 125ºC
  • -65ºC / 150ºC 2 cycles per hour

Other test conditions and soak mode are available upon request

Application

To check ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes


Failure Mechanism: die crack, package crack, wire bond failure, solder fatigue

photo_TC

Test
Temperature Cycling on Board (TCOB)
Condition

IPC-9701

  • -40 °C/125°C 1 cycle per hour

Other test conditions and soak mode are available upon request

Application

Temperature Cycling with continuous resistance monitoring to check solder-joint reliability due to cyclic change in temperature

photo_TCOB

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