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Reliability Services

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Test
Drop Test
Condition

JESD22-B111

  • 1500G, 0.5msec
  • 2900G, 0.3msec

Daisy chain set-up for continuous open/short measurement


Other test conditions are available upon request

Application

To check package and package to board interconnect reliability under mechanical shock.


This test is designed for portable electronics application

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