Technical Publications Development and Package characterization of Advance Leadless Lead-frame Package
Technical Publications Package characterization of UTAC’s Grid Array Package (GQFN) and performance comparison over standard laminate packages
Technical Publications Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Stack
Technical Publications Drop Reliability Study of BGA Assemblies with SAC305, SAC105 and SAC105-Ni Solder Ball on Cu-OSP and ENIG Surface Finish
Technical Publications Impact of Packaging Design on Reliability of Large Die Cu/low-? (BD) Interconnect
Technical Publications Warpage Simulation and DOE Analysis with Application in Package-on-Package Development
Technical Publications Simulation Study on the Warpage Behavior and Board-level Temperature Cycling Reliability of PoP Potentially for High-speed Memory Packaging
Technical Publications Study of Five Substrate Pad Finishes for the Co-design of Solder Joint Reliability under Board-level Drop and Temperature Cycling Test Conditions
Technical Publications Reliability assessment for Cu/Low-k structure based on bump shear modeling and simulation method
Technical Publications Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages
Technical Publications Interfacial Reactions of Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows
Technical Publications Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages
Technical Publications Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition
