Technical Publications Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages
Technical Publications Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging
Technical Publications Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement
Technical Publications Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for PBGA, FBGA and CSP
Technical Publications Characterization of Viscoelastic Behaviour of a Molding Compound with Application to Delamination Analysis in IC Packages
Technical Publications Optimization of Flip Chip Interconnect Reliability Using a Variable Compliance Interconnect Design
Technical Publications Exposed Die-Top Encapsulation Molding for an Improved High-Performance Flip Chip BGA Package
Technical Publications Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP)
Technical Publications Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP)
Technical Publications Performance Assessment on Board-level Drop Reliability for Chip Scale Packages (Fine-pitch BGA)
Technical Publications Analysis of Electromagnetic Susceptibility on High Speed Circuits Located in a Shielded Enclosure
Technical Publications Drop impact reliability testing for lead-free and lead-based soldered IC packages
