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14 Jun 2017

1401 N Shoreline Blvd Mountain View, CA 94043

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GSA Silicon Summit 2017

Join GSA for our 6th annual technology conference in San Jose, California on Wednesday, June 14, 2017. The theme for this year’s event is Emerging Trends in Digital Systems, and we will be addressing Artificial Intelligence, Hyperscale Data Centers, and Refining the IoT Ecosystem. This half-day conference will feature nearly a dozen speakers and more than 350 semiconductor professionals in attendance, so please register early as seating is limited.

17 - 18 May 2017

WTC Grenoble, France

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aff minapd 2017

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
- parallel technical sessions

- poster sessions

- an exhibition. As of today, almost all the booths are already booked.

- tutorials, and additional technical events (May 16, 2017)

04 - 05 Apr 2017

Sofitel Munich Bayerpost, Bayerstrasse 12, 80335 Munich, Germany

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UTAC is pleased to invite you to visit our booth at the GSA European Executive Forum on April 4-5, 2017 at the Sofitel Munich Bayerpost in Munich, Germany.
For more information on this conference and to register, please visit https://www.gsaglobal.org/2017eef/.

We look forward to seeing you at our booth!

01 - 04 Dec 2016

Suntec Singapore Convention & Exhibition Center

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13 - 15 Jun 2016

Raleigh, North Carolina, USA

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3D SiP Embedded Chip Providing Integration Solutions for Power Applications

Presenter: Lee J. Smith

  1. Process and Design Optimization of Lead-frame Packages for Molded Underfill Process Through Mold Flow Simulation

    Authors: Daniel Ting Lee Teh, Jun Dimaano, Preecha Joymak, Apinan Seetao, Kunawut Noisorn

  2. The 1-up strip warpage control of lead frame package

    Authors: Gu Bin, Jun Dimaano, Seow Fui Shi, Dr Nathapong Suthiwongsunthorn

  3. GaN packages' performance study utilizing FEM Analysis and actual assembly build for validation

    Authors: Kyaw Ko Lwin, Jun Dimaano, T.L Teh Daniel, Carolyn E.T, Dr. Nathapong S, Saravuth S

13 - 15 Oct 2015

DoubleTree San Jose Airport Hotel, San Jose, California, USA

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Development Approach & Process Optimization for Sidewall WLCSP Protection

Presenter: Lee J. Smith, Jun Dimaano

13 Oct 2015

California, USA

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Challenges in Packaging

Presenter: Dr Nathapong Suthiwongsunthorn, Vice President, Research & Development

28 - 29 Sep 2015

Convention Centre, Institute of Technical Education, Singapore

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Test Manufacturing Challenges in the New Era

Presenter: S.H.V Ramanan, Senior Manager, Test & Product Engineering

05 - 06 May 2015

Tel Aviv, Israel

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Development and Package Characterization of Advance Leadless Lead-frame Package

Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul, Nathapong Suthiwongsunthorn

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