MINAPAD 2019

11 Jul 2019Centre de congrès du WTC Grenoble

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 22-23, 2019.

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community :

  • parallel technical sessions
  • an exhibition
  • additional technical events (May 21, 2019)
Download the program here.

Click here to register for MINAPAD 2019.

Visit Website

GSA Silicon Summit 2018

19 Apr 2018150 West San Carlos Street San Jose, CA 95113

Join GSA for our 7th annual technology conference in San Jose, California on Thursday, April 19, 2018. The theme for this year’s event is New Systems Architectures Enabling Automotive and Internet-of-Things Markets. We have a great line up of speakers who will discuss various architectures supporting the Automotive electronics and IoT markets. This full-day conference will feature nearly a dozen speakers from experts in the industry and brings together over 300 semiconductor executives and professionals for discussions and thought exchange. GSA’s Silicon Summit promotes collaboration for the advancement of technology, business, and education, with the ultimate goal of improving efficiencies and strengthening our industry. Please register early as seating is limited.

Visit Website

GSA Silicon Summit 2017

14 Jun 20171401 N Shoreline Blvd Mountain View, CA 94043

Join GSA for our 6th annual technology conference in San Jose, California on Wednesday, June 14, 2017. The theme for this year’s event is Emerging Trends in Digital Systems, and we will be addressing Artificial Intelligence, Hyperscale Data Centers, and Refining the IoT Ecosystem. This half-day conference will feature nearly a dozen speakers and more than 350 semiconductor professionals in attendance, so please register early as seating is limited.

Visit Website

MiNaPAD Forum 2017

17 - 18 May 2017WTC Grenoble, France

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community: - parallel technical sessions - poster sessions - an exhibition. As of today, almost all the booths are already booked. - tutorials, and additional technical events (May 16, 2017)

Visit Website

GSA European Executive Forum

04 - 05 Apr 2017Sofitel Munich Bayerpost, Bayerstrasse 12, 80335 Munich, Germany

UTAC is pleased to invite you to visit our booth at the GSA European Executive Forum on April 4-5, 2017 at the Sofitel Munich Bayerpost in Munich, Germany. For more information on this conference and to register, please visit https://www.gsaglobal.org/2017eef/.

We look forward to seeing you at our booth!

Visit Website

18th Electronics Packaging Technology Conference 2016 (EPTC 2016)

01 - 04 Dec 2016Suntec Singapore Convention & Exhibition Center

Download

Visit Website

International Symposium on 3D-PEIM 2016

13 - 15 Jun 2016Raleigh, North Carolina, USA

3D SiP Embedded Chip Providing Integration Solutions for Power Applications

Presenter: Lee J. Smith

Download

Visit Website

17th Electronics Packaging Technology Conference (EPTC 2015)

02 - 04 Dec 2015Marina Mandarin, Singapore

  1. Process and Design Optimization of Lead-frame Packages for Molded Underfill Process Through Mold Flow Simulation
    Authors: Daniel Ting Lee Teh, Jun Dimaano, Preecha Joymak, Apinan Seetao, Kunawut Noisorn
  2. The 1-up strip warpage control of lead frame package
    Authors: Gu Bin, Jun Dimaano, Seow Fui Shi, Dr Nathapong Suthiwongsunthorn
  3. GaN packages' performance study utilizing FEM Analysis and actual assembly build for validation
    Authors: Kyaw Ko Lwin, Jun Dimaano, T.L Teh Daniel, Carolyn E.T, Dr. Nathapong S, Saravuth S

Download

Download

Download

Visit Website

12th International Wafer-Level Packaging Conference (IWLPC 2015)

13 - 15 Oct 2015DoubleTree San Jose Airport Hotel, San Jose, California, USA

Development Approach & Process Optimization for Sidewall WLCSP Protection

Presenter: Lee J. Smith, Jun Dimaano

Download

Visit Website

Semico Impact 2015

13 Oct 2015California, USA

Challenges in Packaging

Presenter: Dr Nathapong Suthiwongsunthorn, Vice President, Research & Development

Visit Website

Microelectronics Tech Asia Singapore 2015

28 - 29 Sep 2015Convention Centre, Institute of Technical Education, Singapore

Test Manufacturing Challenges in the New Era

Presenter: S.H.V Ramanan, Senior Manager, Test & Product Engineering

Visit Website

ChipEx 2015

05 - 06 May 2015Tel Aviv, Israel

Development and Package Characterization of Advance Leadless Lead-frame Package

Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul, Nathapong Suthiwongsunthorn

Visit Website

SEMICON Southeast Asia 2015

22 - 24 Apr 2015SPICE Arena - Penang, Malaysia

Test Manufacturing Challenges in the New Era

Author: S.H.V. Ramanan, Senior Manager, Test and Product Engineer  

Download

Visit Website

MiNaPAD Forum 2015

22 - 23 Apr 2015WTC (World Trade Center) Grenoble, France

Development and Package Characterization of Advance Leadless Lead-frame Package

Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul, Nathapong Suthiwongsunthorn

Visit Website

MiNaPAD Forum 2015

22 Apr 2015

Technical Paper - Development and Package characterization of Advance Leadless Lead-frame Package

Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn

Download

South East Asia Technical Conference on Electronics Assembly

14 - 16 Apr 2015Eastin Hotel, Penang, Malaysia

Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability

Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul

Visit Website

SMTA, South East Asia Technical Conference (Presentation)

16 Apr 2015

Presentation - "Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability"

Author: Kyaw Ko Lwin

Download

SMTA, South East Asia Technical Conference (Technical Paper)

16 Apr 2015

Technical Paper - "Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability"

Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn and Saravuth Sirinorakul

Download

South East Asia Technical Conference on Electronics Assembly

14 - 16 Apr 2015Eastin Hotel, Penang, Malaysia

Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability

Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul

Visit Website

IoT Asia 2015

08 - 09 Apr 2015MAX Atria, Singapore EXPO

Photo Gallery

Visit Website

Technical Session F

05 Dec 2014

Package Characterization of UTAC's Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages

Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn

Download

Technical Session D3 - Mechanical Modelling 1

05 Dec 2014

Unit Warpage Control with Universal Die Thickness

Author: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn

Download

16th Electronics Packaging Technology Conference (EPTC)

03 - 05 Dec 2014Marina Bay Sands, Singapore

  1. Unit Warpage Control with Universal Die Thickness Authors: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn
  2. Package Characterization of UTAC's Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages Authors: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn

Download

Visit Website

Workshop on Microelectronics Manufacturing Trends 2014 (WMMT)

21 Nov 2014ITE College Central, Singapore

Internet of Things (IoTs) and its impact on Semiconductor Packaging Author: Dr Nathapong Suthiwongsunthorn, Vice President, Research and Development

Download

Visit Website