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December 05, 2024
Transforming challenges into opportunities—2024 has been a pivotal year for semiconductor manufacturing companies.
The 2024 GSA Awards Dinner was a celebration of transformative achievements in our industry, where UTAC Group was honored to participate in an unforgettable night of recognition, networking, and celebration.
We remain proud to be among the leading OSATs delivering state-of-the-art solutions for a rapidly evolving semiconductor landscape.
December 11-12 
Shanghai | Booth #E55/56/57/58For 29 years, the China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has played an important role in promoting industrial agglomeration, connecting industrial resources, and grasping industry trends. ICCAD-Expo 2024 will hold opportunities for in-depth discussions of the challenges faced by the integrated circuit industry.
With this year’s theme of “Smart Shanghai, Core Powering the World”, UTAC is proud to showcase its commitment as a chip making company to innovation with industry-leading solutions. Visit our booth to see how our advanced packaging and testing expertise can power your next breakthrough.
October 16 - 18, 2024 Penang, MalaysiaA long-standing industry conference, IEMT 2024 brings together global leaders with deep insights into the technologies and innovations shaping the future of electronics production.
Organized by IEEE's Electronics Packaging Society (EPS), IEMT2024 focuses on breakthrough developments in the manufacture of electronic, opto-electronic, and MEMS/sensor devices.
Alastair Attard, UTAC Group Director of Business Development will contribute to the discussion on advanced packaging solutions, presenting his talk on "Automotive Image Sensor Packaging for ADAS / AD".
Come join us at Booth 5 at IEMT 2024 to learn about the future of electronics manufacturing technology.
ISES EU Power 2024
June 25 - 26, 2024 Porto, Portugal
International Semiconductor Executive Summit EU Power provides a unique platform for networking and expanding your knowledge base.
ISES EU Power will cover a number of topics regarding power electronics. As industries and countries around the world push to increase energy efficiency and reduce CO2 emissions, power electronics will play a key role in technological advancement.
Join us at ISES EU Power 2024!
Attendees: Jonathan Abela, Senior VP of WW Sales & Marketing, and Alastair Attard, Director of Sensing Applications
MiNaPAD 2024
June 19 - 20, 2024 Grenoble, France
MiNaPAD, the "Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum," is a two-day conference featuring an exhibition. The event aims to strengthen the design community, which represents the largest segment of the semiconductor industry in Europe, as well as the assembly and packaging community.
Highlights include parallel technical sessions, an exhibition and additional technical events.
Join us at the MiNaPad Forum 2024, featuring speaker Alastair Attard, Director of Sensing Applications.
MWS EU 2024
June 27 - 28, 2024 Porto, Portugal
The International Semiconductor Executive Summits (ISES) hold a significant position within the semiconductor industry, serving as a premier platform for senior executives in technology, manufacturing, and R&D from various semiconductor companies, technology providers, and related industries. These summits facilitate the exchange of information, strategic planning, and discussions on the industry's future directions.
Join us at the MEMS World Summit (MWS EU 2024), featuring speaker Alastair Attard, Director of Sensing Applications.
GSA European Executive Forum 2024
June 18 - 19, 2024Munich, Germany
The GSA European Executive Forum is a flagship event in Europe which, over two days, attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles. Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region, where leaders meet to establish a profitable and sustainable semiconductor and high tech global ecosystem.
Attendees: Jonathan Abela, Senior VP of WW Sales & Marketing, and Alastair Attard, Director of Sensing Applications
PowerUP Asia 2024
Power Semiconductor Innovations Toward Green Goals, Decarbonization and Sustainability
June 11-12, 2024Virtual Event
PowerUP Asia is a two-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy. PowerUP Asia 2024 will bring the latest developments in power semiconductor and engineering, and how the industry can explore ways to accelerate the pathway to net-zero carbon emissions.
Speaker: Hyungmook Choi (Michael Choi),VP of power business development, UTAC Group
Click here to register for PowerUP Asia 2024
PowerUP Asia 2023
Spotlight on Asia's Power Electronics Innovations, Trends, and Developments
24-26 May 2023Virtual Event
PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy.
Speaker: Hyungmook Choi (Michael Choi),VP of power business development, UTAC Group
Click here to register for PowerUP Asia 2023
Image Sensors Europe
15-16 March 2023London, UK
THE LEADING EVENT FOR PROFESSIONALS IN THE INDUSTRY, Image Sensors Europe returned to London on 15-16 March 2023 and once again united over 250+ vision system representatives.The event drove learnings and discussions on the future market and technology image sensor trends.
Click here to register for Image Sensors Europe 2023
Image Sensor Solutions for Automotive Imaging Applications
17 - 18 JANUARY 2023Theatre@illuminITE College Central, Singapore
Advanced Semiconductor Technology Conference (ASTC) 2023, With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
Click here to register for Image Sensor Solutions for Automotive Imaging Applications 2023
MINAPAD 2019
11 Jul 2019Centre de congrès du WTC Grenoble
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 22-23, 2019.
MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community :
- parallel technical sessions
- an exhibition
- additional technical events (May 21, 2019)
Click here to register for MINAPAD 2019.
GSA Silicon Summit 2018
19 Apr 2018150 West San Carlos Street San Jose, CA 95113
Join GSA for our 7th annual technology conference in San Jose, California on Thursday, April 19, 2018. The theme for this year’s event is New Systems Architectures Enabling Automotive and Internet-of-Things Markets. We have a great line up of speakers who will discuss various architectures supporting the Automotive electronics and IoT markets. This full-day conference will feature nearly a dozen speakers from experts in the industry and brings together over 300 semiconductor executives and professionals for discussions and thought exchange. GSA’s Silicon Summit promotes collaboration for the advancement of technology, business, and education, with the ultimate goal of improving efficiencies and strengthening our industry. Please register early as seating is limited.
GSA Silicon Summit 2017
14 Jun 20171401 N Shoreline Blvd Mountain View, CA 94043
Join GSA for our 6th annual technology conference in San Jose, California on Wednesday, June 14, 2017. The theme for this year’s event is Emerging Trends in Digital Systems, and we will be addressing Artificial Intelligence, Hyperscale Data Centers, and Refining the IoT Ecosystem. This half-day conference will feature nearly a dozen speakers and more than 350 semiconductor professionals in attendance, so please register early as seating is limited.
MiNaPAD Forum 2017
17 - 18 May 2017WTC Grenoble, France
MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community: - parallel technical sessions - poster sessions - an exhibition. As of today, almost all the booths are already booked. - tutorials, and additional technical events (May 16, 2017)
GSA European Executive Forum
04 - 05 Apr 2017Sofitel Munich Bayerpost, Bayerstrasse 12, 80335 Munich, Germany
UTAC is pleased to invite you to visit our booth at the GSA European Executive Forum on April 4-5, 2017 at the Sofitel Munich Bayerpost in Munich, Germany. For more information on this conference and to register, please visit https://www.gsaglobal.org/2017eef/.
We look forward to seeing you at our booth!
18th Electronics Packaging Technology Conference 2016 (EPTC 2016)
01 - 04 Dec 2016Suntec Singapore Convention & Exhibition Center
International Symposium on 3D-PEIM 2016
13 - 15 Jun 2016Raleigh, North Carolina, USA
3D SiP Embedded Chip Providing Integration Solutions for Power Applications
Presenter: Lee J. Smith
17th Electronics Packaging Technology Conference (EPTC 2015)
02 - 04 Dec 2015Marina Mandarin, Singapore
- Process and Design Optimization of Lead-frame Packages for Molded Underfill Process Through Mold Flow Simulation
Authors: Daniel Ting Lee Teh, Jun Dimaano, Preecha Joymak, Apinan Seetao, Kunawut Noisorn - The 1-up strip warpage control of lead frame package
Authors: Gu Bin, Jun Dimaano, Seow Fui Shi, Dr Nathapong Suthiwongsunthorn - GaN packages' performance study utilizing FEM Analysis and actual assembly build for validation
Authors: Kyaw Ko Lwin, Jun Dimaano, T.L Teh Daniel, Carolyn E.T, Dr. Nathapong S, Saravuth S
12th International Wafer-Level Packaging Conference (IWLPC 2015)
13 - 15 Oct 2015DoubleTree San Jose Airport Hotel, San Jose, California, USA
Development Approach & Process Optimization for Sidewall WLCSP Protection
Presenter: Lee J. Smith, Jun Dimaano
Semico Impact 2015
13 Oct 2015California, USA
Challenges in Packaging
Presenter: Dr Nathapong Suthiwongsunthorn, Vice President, Research & Development
Microelectronics Tech Asia Singapore 2015
28 - 29 Sep 2015Convention Centre, Institute of Technical Education, Singapore
Test Manufacturing Challenges in the New Era
Presenter: S.H.V Ramanan, Senior Manager, Test & Product Engineering
ChipEx 2015
05 - 06 May 2015Tel Aviv, Israel
Development and Package Characterization of Advance Leadless Lead-frame Package
Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul, Nathapong Suthiwongsunthorn
SEMICON Southeast Asia 2015
22 - 24 Apr 2015SPICE Arena - Penang, Malaysia
Test Manufacturing Challenges in the New Era
Author: S.H.V. Ramanan, Senior Manager, Test and Product Engineer
MiNaPAD Forum 2015
22 - 23 Apr 2015WTC (World Trade Center) Grenoble, France
Development and Package Characterization of Advance Leadless Lead-frame Package
Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul, Nathapong Suthiwongsunthorn
MiNaPAD Forum 2015
22 Apr 2015
Technical Paper - Development and Package characterization of Advance Leadless Lead-frame Package
Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn
South East Asia Technical Conference on Electronics Assembly
14 - 16 Apr 2015Eastin Hotel, Penang, Malaysia
Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability
Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul
SMTA, South East Asia Technical Conference (Presentation)
16 Apr 2015
Presentation - "Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability"
Author: Kyaw Ko Lwin
SMTA, South East Asia Technical Conference (Technical Paper)
16 Apr 2015
Technical Paper - "Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability"
Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn and Saravuth Sirinorakul
South East Asia Technical Conference on Electronics Assembly
14 - 16 Apr 2015Eastin Hotel, Penang, Malaysia
Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and its Board Level Reliability
Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul
![](https://www.utacgroup.com/wp-content/uploads/2019/09/2015-04-08-iot-asia-p5.jpg")
Technical Session F
05 Dec 2014
Package Characterization of UTAC's Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages
Author: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn
Technical Session D3 - Mechanical Modelling 1
05 Dec 2014
Unit Warpage Control with Universal Die Thickness
Author: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn
16th Electronics Packaging Technology Conference (EPTC)
03 - 05 Dec 2014Marina Bay Sands, Singapore
- Unit Warpage Control with Universal Die Thickness Authors: Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn
- Package Characterization of UTAC's Grid Array Package (GQFN) and Performance Comparison Over Standard Laminate Packages Authors: Daniel Ting Lee Teh, Carolyn Epino Tubillo, Kyaw Ko Lwin, Gu Bin, Ang Choon Ghee, Jun Dimaano, Saravuth Sirinorakul and Dr Nathapong Suthiwongsunthorn
Workshop on Microelectronics Manufacturing Trends 2014 (WMMT)
21 Nov 2014ITE College Central, Singapore
Internet of Things (IoTs) and its impact on Semiconductor Packaging Author: Dr Nathapong Suthiwongsunthorn, Vice President, Research and Development
