full-resources Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn,

Technical Publications

white-paper Gu Bin, Jun Dimaano Jr., Richen Chen, Eric Bool, Seow Fui Shi, Choon Ghee Ang and Dr Nathapong Suthiwongsunthorn,

"Unit Warpage Control with Universal Die Thickness", 16th Electronics Packaging Technology Conference (EPTC), 3-5 Dec 2014, Singapore

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