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Package Characterization

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UTAC Corporate Analysis Services

 

UTAC R&D has been established for more than 10 years and has developed strong thermal, mechanical, electrical and process analysis expertise. UTAC offers a broad range of simulation capabilities, measurement facilities and amassed over 2,000 analysis reports.

 

 

Vision & Mission

Working closely together with cross-functional teams from all sites during the entire product life cycle, to be the leading package analysis solutions and advanced packaging technologies provider to our customers.

Close-Loop One-stop Solution Enhance Product Yield and Reduce Cycle Time

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Roles of Analysis

  • Predict Package Behavior 
    Minimize failure and optimize performance
  • Upfront Design
    Save cost and reducing the cycle time to market
  • Extensive insights to underlying physics
    Behind the complex IC assembly
  • Reduce loading on process
    Conserving process resources for more critical applications.
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UTAC Thermal Analysis Overview

UTAC R&D has been established for more than 10 years and has developed strong thermal analysis expertise, broad range of thermal simulation capabilities, measurement facilities and amassed over 600 thermal analysis reports. Thermal analysis is available for a wide array of packages and system ranging from Multi-chip, system in a package (SiP), memory, power application, analog, mixed signal, wireless communication, etc.

UTAC Thermal Simulation And Measurement Tools And Services

UTAC has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers' needs, as summarized in Fig.1 and Fig.2. UTAC team is dedicated to deliver timely and quality solutions to best meet customers' increasing challenging packaging needs.

UTAC Thermal Analysis Tools

  • Simulation FloTHERM and ANSYS Icepak
  • Test Measurement
  • Compact Models
  • Prediction Tools
  • System Level Simulation
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UTAC Thermal Analysis Services

  • Package Thermal Performance Verification and Comparison
  • Package Thermal Solutions
  • External Heat Sink Design
  • Compact Models for Packages
  • System Level Thermal Simulations for Selected Applications

Fig.1: Thermal Analysis Services Summary

Software
FloTHERM PACK
Flo THERM
ANSYS DesignModeler
Workbench
ANSYS Icepak
Thermal Measurement Lab (Hardware)  
Test Environments Standard Thermal Parameter
Still Air Box JESD 51-6 Theta JA, Psi JT and Psi JB
Wind Tunnel for Forced Air Convection JESD 51-6 Theta JMA, Psi JT and Psi JB
Ring Cold Plate JESD 51-8 Theta JB
Top Cold Plate NA Theta JC

Fig.2: Thermal Analysis Software and Thermal Measurement Lab

For more information on UTAC Thermal Analysis Services, please download here. Pdf document

 

Thermal Calculator

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UTAC Mechanical Analysis Overview

UTAC R&D has amassed wealth of knowledge and experience both in theoretical simulation study as well as experimental/characterization at package level and board level. Numerous analysis have been conducted for a myriad of packages with extensive library technical reports. UTAC continuously expand its experience to include advance and cutting-edge package technologies.

UTAC Mechanical Simulation And Measurement Tools And Services

UTAC extensive mechanical analysis and characterization/measurement is summarized in Fig.1. It includes the analysis of the package and board level quality and reliability. UTAC team is dedicated to deliver timely and quality solutions to best meet customers' increasing challenging packaging needs.

UTAC Mechanical Simulation And Measurement Tools And Services
Fig.3: Mechanical Analysis Summary

UTAC Electrical Analysis Overview

UTAC offers a wide array of packages ranging from memory, power application, analog, mixed signal, wireless communication packages etc. Each packages would have specific electrical requirements in signal integrity and power integrity. It is critical to have appropriate electrical modelling and characterization capabilities to ensure that the package offered can meet the requirements. UTAC has the know-how and extensive electrical simulation and characterization capabilities to meet the increasing demand and requirements of our array of packages, including advanced packages. Electrical analysis is involved in pre-layout design guideline, design optimization, all the way to package performance verification and failure analysis.

UTAC Electrical Simulation And Measurement Tools And Services

UTAC has comprehensive electrical analysis and measurement/characterization capabilities that cover a wide range of customer's need as can be seen in Fig.1. The simulation capabilities include, but not limited to, 2-D, 3-D, full wave simulation in time and frequency domain.

UTAC Electrical Analysis Tools

  • Quasi-static parasitic extraction (RLC) and equivalent circuit model generation of partial or whole package
  • Cross-talk / coupling analysis
  • Impedance control / analysis
  • S-parameter analysis
  • TDR measurement
  • VNA measurement
  • Failure isolation using TDR
  • Power integrity analysis
  • Substrate / PCB signal integrity analysis
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Output Parameter

  • RLC matrix
  • SPICE model
  • BIS
  • S-parameter data
  • Trace impedance matching / control
  • PDN analysis (IR drop, current density, resonance, and impedance profile)
  • Time-domain SI analysis (x-talk, delay, ringing, reflection, eye diagram)

 Fig.4: Electrical Analysis Summary

QFN Electrical Performance Calculator

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UTAC Moldflow Analysis Overview

UTAC has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers' needs. Simulation and validation services are available for a wide array of packages ranging from memory, power application, analog, mixed signal, wireless communication packages etc.

Increasing challenges to ensure moldability with rapid advances in flip-chip technology such as decreasing bump pitch and stand-off height, especially when commercial Moldable Underfill (MUF) is used and in particular, during panel level molding. One key challenge is severe void entrapment under the die. Experiments involving a large DOE matrix, which require significant time and resources, are typically used to solve the issue. 3D moldflow simulation can be used to optimize the design, material and process to reduce defects, cutting down the DOE matrix for experiments. Moldflow simulation can effectively shorten the design-to-implementation cycle time, identifying key problems before actual fabrication.

UTAC Moldflow Analysis
Fig.5: Moldflow Analysis Summary

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