banner-services2 Packaging Capability and Assembly Services | UTAC

Packaging Capability and Assembly Services

banner assemblyservices

At UTAC we offer a wide range of semiconductor assembly services to meet our customers’ needs and the increasing market demand for next generation devices. UTAC has a diverse capability spanning across ten factories, in six countries in the Asia Pacific region. Our packaging capability includes Leadless Packages, Wafer Level Packages, System in Package (SiP), Laminate Packages, Leaded Packages and Security Smart Card Module and Smart Card Inlay.

 

To complement our packaging solutions we have state of the art design and package characterization capabilities to help our customers achieve both performance and cost objectives. Our engineering teams collaborate closely with customers to understand the performance requirements and utilize our proprietary calculators and design tools to accelerate the package design phase.

 

Once the design is approved, we use a proven project management methodology to facilitate the new product introduction, taking the product through a rigorous phase gate process to ensure first time qualification.

Leadframe Packages

QFN, DFN, and Dual-row QFN

The QFN (Quad Flat No-Lead) package is a popular and cost effective plastic package which was introduced by UTAC in 1998, adding a leadless concept into UTAC's expanding portfolio. The package is a superior choice for high speed applications where thermal and electrical performance is paramount and space constraint is unavoidable. For thermal solutions, it has the ability to mount the die attach pad directly to the board for heat dissipation.

 

UTAC has a variety of advanced options that enable the QFN package to be introduced to a variety of end product applications in the automotive and consumer space.

 

  • Package Thickness options: 0.33, 0.40, 0.50, 0.55, 0.80, 0.90, 1.00mm maximum
  • Halogen free and RoHS Bill of material
  • Bond Wire: Au, AuPdCu, PdCu and Bare Cu Wire
  • Lead finish options: Matte Tin, PPF
  • Advanced options: Stacked die, MCM side by side, Flip-Chip with Cu Pillar, SiP, Solderable sidewall (SLP) & Thin
  • In development: Air Cavity, 0.20mm maximum thickness

 

qfn-single Packaging Capability and Assembly Services | UTACQFN single row
pad-qfn Packaging Capability and Assembly Services | UTACTop Expose Pad QFN
fcqfn Packaging Capability and Assembly Services | UTACExpose Die fcQFN
qfn-dual Packaging Capability and Assembly Services | UTACQFN dual row
flip-chip-qfn Packaging Capability and Assembly Services | UTACFlip Chip QFN
Body Size Terminal Pitch Terminal Count
0.6 x 1.0 0.50 2, 3
1.13 x 1.1 0.50 6
2 x 2 0.50 8,10
3 x 3 0.40, 0.50, 0.65 8 to 20
4 x 4 0.40, 0.50, 0.65 12 to 28
4 x 5 0.50 24, 28
5 x 5 0.40, 0.50, 0.65 20 to 40
5 x 6 0.65 22
5 x 7 0.50 38
6 x 6 0.40, 0.50, 0.65 24 to 48
7 x 7 0.40, 0.50, 0.65 32 to 56
8 x 8 0.40, 0.50, 0.65 36 to 68
9 x 9 0.40, 0.50, 0.65 44 to 76
10 x 10 0.40, 0.50 68 to 88
12 x 12 0.50 80
14 x 14 0.50 100

LLGA

In line with it's legacy of introducing innovative packaging solutions, UTAC offers a wide variety of multi row leadframe based leadless packaging solutions. This includes various leadframe fabrication technologies such as etch through, double half etch and metal build up. These advanced leadframe packages provide a high I/O density and smaller footprint compared to most leadframe based package technologies. Most designs are fully customizable and enables manufacturers to shrink die sizes and benefit from the latest fab technology.

 

Package Features

 

  • Package can be designed around the die
  • 0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
  • Overall package thickness down to 0.40mm max
  • Optional package standoff that provides self centering during SMT process
  • Strip level testing (no additional process required)
  • Busless design with no exposed copper on sidewalls

 

llga Packaging Capability and Assembly Services | UTAC

Advanced Options

 

  • Stacked die, MCM, Flip Chip option and System in package

 

Package Body Size I/O Pitch
LLGA 0.60x1.0 to 4x4mm 2 to 40 0.40 to 0.80mm

GQFN

In line with it's legacy of introducing innovative packaging solutions, UTAC offers a wide variety of multi row leadframe based leadless packaging solutions. This includes various leadframe fabrication technologies such as etch through, double half etch and metal build up. These advanced leadframe packages provide a high I/O density and smaller footprint compared to most leadframe based package technologies. Most designs are fully customizable and enables manufacturers to shrink die sizes and benefit from the latest fab technology.

 

Package Features

 

  • Package can be designed around the die
  • 0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
  • Overall package thickness down to 0.40mm max
  • Optional package standoff that provides self centering during SMT process
  • Strip level testing (no additional process required)
  • Busless design with no exposed copper on sidewalls
  • Routable traces

 

gqfn Packaging Capability and Assembly Services | UTACGQFN (PPF)
gqfn-ball Packaging Capability and Assembly Services | UTACGQFN with Ball Attach

Advanced Options

 

  • Stacked die, MCM, Flip Chip option and System in package

 

gqfn-sip Packaging Capability and Assembly Services | UTACGQFN-SiP
Package Body Size I/O Pitch
GQFN 2x2 to 10x10mm 24 to 268 0.40 to 0.65mm

TLA

In line with it's legacy of introducing innovative packaging solutions, UTAC offers a wide variety of multi row leadframe based leadless packaging solutions. This includes various leadframe fabrication technologies such as etch through, double half etch and metal build up. These advanced leadframe packages provide a high I/O density and smaller footprint compared to most leadframe based package technologies. Most designs are fully customizable and enables manufacturers to shrink die sizes and benefit from the latest fab technology.

 

Package Features

 

  • Package can be designed around the die
  • 0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
  • Overall package thickness down to 0.40mm max
  • Optional package standoff that provides self centering during SMT process
  • Strip level testing (no additional process required)
  • Busless design with no exposed copper on sidewalls

 

tla

Advanced Options

 

  • Stacked die, MCM, Flip Chip option and System in package

 

PackageBody SizeI/OPitch
TLA 4x4 to 17x17mm 20 to 348 0.40 to 0.65mm

TAPP

In line with its legacy of introducing innovative packaging solutions, UTAC offers a wide variety of multi row leadframe based leadless packaging solutions. This includes various leadframe fabrication technologies such as etch through, double half etch and metal build up. These advanced leadframe packages provide a high I/O density and smaller footprint compared to most leadframe based package technologies. Most designs are fully customizable and enables manufacturers to shrink die sizes and benefit from the latest fab technology.

 

Package Features

 

  • Package can be designed around the die
  • 0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
  • Overall package thickness down to 0.40mm max
  • Optional package standoff that provides self centering during SMT process
  • Strip level testing (no additional process required)
  • Busless design with no exposed copper on sidewalls

 

Advanced Options

 

  • Stacked die, MCM, Flip Chip option and System in package

 

PackageBody SizeI/OPitch
TAPP 2x1.3 to 17x17mm 6 to 348 0.40 to 0.65mm

QFP

UTAC offers a wide array of packages from MQFP, LQFP and TQFP's in various body sizes and lead counts, body thicknesses and footprints. Open tooled lead frames are available for various die sizes both in die up and die down configurations. Custom leadframe designs are also supported. All QFP's are assembled with Halogen free and RoHS compliant material set.

 

Thermal and electrical performance enhancements are possible with the following advanced options:

 

  • EDQUAD
  • Exposed Copper Heat Slug
  • Embedded Aluminum Heat Spreader
  • Exposed Die Attach Pad
  • Die up or Die down versions

 

Options:

 

  • Stacked Die
  • Pd/Cu Bonding Wire

 

Package OptionBody SizeBody ThicknessFootprintExternal Lead PitchLead Count
Standard QFP 5x5 to 32x32 1.00 to 3.50mm 2.00 to 3.90 0.40 to 1.00mm 20 to 240
EDQUAD 10x10 to 32x32 1.40 to 3.50mm 2.00 to 3.90 0.40 to 1.00mm 44 to 240
Exposed Cu Heat Slug 14x14 to 28x28 1.40 to 3.50mm 2.00 to 3.90 0.50 to 1.00mm 64 to 208
Embedded Aluminum Heatspreader 5x5 to 32x32 1.40 to 3.50mm 2.00 to 3.90 0.40 to 1.00mm 20 to 240
Exposed Die Attach Pad 7x7 to 32x32 1.40 to 3.50mm 2.00 to 3.90 0.40 to 1.00mm 32 to 240

DIP

UTAC offers a variety of JEDEC compliant leadframe based through hole (PDIP) and surface mount small outline packages using the popular gull wing format. Wide range of body size available. Thermally enhanced exposed e-pad versions are available for MSOP and TSSOP packages.

 

SC703, 4, 5, 82.0 x 1.25 mmMSOP / eMSOP8, 103.0 x 3.0 mm
Package TypeLead CountBody Size
PDIP 6,7,8 300 mils

SOIC/SSOP/QSOP

UTAC offers a variety of JEDEC compliant leadframe based through hole (PDIP) and surface mount small outline packages using the popular gull wing format. Wide range of body size available. Thermally enhanced exposed e-pad versions are available for MSOP and TSSOP packages.

 

SC703, 4, 5, 82.0 x 1.25 mmMSOP / eMSOP8, 103.0 x 3.0 mm

Package TypeLead CountBody Size
SOIC 7, 8, 14, 16
8
16, 18, 20, 28
150 mils
207 mils
300 mils
SSOP 20 205 mils
QSOP 16, 20, 24, 28 150 mils

TSSOP

UTAC offers a variety of JEDEC compliant leadframe based through hole (PDIP) and surface mount small outline packages using the popular gull wing format. Wide range of body size available. Thermally enhanced exposed e-pad versions are available for MSOP and TSSOP packages.

 

SC703, 4, 5, 82.0 x 1.25 mmMSOP / eMSOP8, 103.0 x 3.0 mm
Package TypeLead CountBody Size
TSSOP / eTSSOP 8, 14, 16, 20, 24, 28 , 38 4.4 mm

MSOP

UTAC offers a variety of JEDEC compliant leadframe based through hole (PDIP) and surface mount small outline packages using the popular gull wing format. Wide range of body size available. Thermally enhanced exposed e-pad versions are available for MSOP and TSSOP packages.

 

SC703, 4, 5, 82.0 x 1.25 mmMSOP / eMSOP8, 103.0 x 3.0 mm

SOT/SC

UTAC offers a variety of JEDEC compliant leadframe based through hole (PDIP) and surface mount small outline packages using the popular gull wing format. Wide range of body size available. Thermally enhanced exposed e-pad versions are available for MSOP and TSSOP packages.

 

SC703, 4, 5, 82.0 x 1.25 mmMSOP / eMSOP8, 103.0 x 3.0 mm
Package TypeLead CountBody Size
SOT23
Thin SOT23
3, 4, 5, 6, 8
5, 6
2.9 x 1.6 mm

Laminate Packages

Flip Chip Packages

UTAC offers a comprehensive range of flip chip packages which allows a direct interconnect between the die and the substrate thru solder or copper pillar bumps. Our packages range from using laminate or leadframe packages.

 

Available Packages:

 

  • Flip Chip CSP
  • Flip Chip BGA
  • Flip Chip QFN's

 

flip1 Packaging Capability and Assembly Services | UTAC
flip2 Packaging Capability and Assembly Services | UTAC
flip3 Packaging Capability and Assembly Services | UTAC
flip4 Packaging Capability and Assembly Services | UTAC
flip5 Packaging Capability and Assembly Services | UTAC

Packaging Options:

 

  • Bare die, Molded or Exposed Die Backside
  • Multi Die Configuration (Side by side or Stacked wirebond die)
  • Passive component integration including EMI Shielding
  • Standard capillary or moldable underfill
  • Thermal Enhancement with Heatspreader option
  • Eutectic, Pb Free and Copper Pillar Bumps

 

flip6 Packaging Capability and Assembly Services | UTAC
flip7 Packaging Capability and Assembly Services | UTAC
flip8 Packaging Capability and Assembly Services | UTAC
flip9 Packaging Capability and Assembly Services | UTAC

System in Packages (SiP)

With the ever increasing demand for a more cost effective form factor reduction, demand for SiP has also increased. UTAC offers various SiP solutions depending on our customer's requirements by integrating various components in the package. These may include passive components, saw filters, prepackaged IC's and EMI shieldings. UTAC is committed to provide the best SiP solution for our customer's needs.

 

Advantages

 

  • Cost effective SoC alternative
  • Reduced Package footprint
  • Allows mixed IC technologies that can be separately optimized
  • Design flexibility
  • Shorter development time and cost
  • Faster time to market

 

system1 Packaging Capability and Assembly Services | UTAC LGA-SiP (Multichip RF)
system4 Packaging Capability and Assembly Services | UTAC SiP QFN
system2 Packaging Capability and Assembly Services | UTAC Special Components / P in P (CUF / MUF)
system3 Packaging Capability and Assembly Services | UTAC 8-Die Stacking (0.9mm Mold Cap)
system5 Packaging Capability and Assembly Services | UTAC GQFN-SiP
system6 Packaging Capability and Assembly Services | UTAC fcBGA SiP (Solder)

Packaging Options:

 

  • Available in Laminate or Leadframe based packages
  • Multi Die Configuration (Side by side or Stacked wirebond die)
  • Passive component integration including EMI Shielding
  • Capable up to 01005 chip component
  • Package in Package option available
  • Thermal Enhancement with Heatspreader option

 

system7 Packaging Capability and Assembly Services | UTAC Special SIM Card
system8 Packaging Capability and Assembly Services | UTAC MSD Card
system9 Packaging Capability and Assembly Services | UTAC USB / UDP Drive
system10 Packaging Capability and Assembly Services | UTAC LGA-SiP-GT (TCS)

BGA (Ball Grid Arrays / Land Grid Arrays)

UTAC offers various versions of BGA packages either in array, pocket molded or dam and fill configurations.

 

Package Features:

 

  • Material Construction of BT or Polyimide tape
  • Thru hole or build up multilayer construction
  • 0.40, 0.50, 0.65,0.80,1.00 and 1.27mm pitch available
  • Halogen free and RoHS compliant bill of materials
  • Various solder alloy for standard and leadfree applications

 

bga1 Packaging Capability and Assembly Services | UTAC wBGA
bga2 Packaging Capability and Assembly Services | UTAC PBGA
bga3 Packaging Capability and Assembly Services | UTAC 5 die stacked, (0.8mm mold)
bga4 Packaging Capability and Assembly Services | UTAC EBGA (2L/4L std / build-up)
bga5 Packaging Capability and Assembly Services | UTAC TBGA / CL-TBGA [ 1 & 2 Layers]
bga6 Packaging Capability and Assembly Services | UTAC CMOS Image Sensor
bga7 Packaging Capability and Assembly Services | UTAC XP-FBGA (0.95 mm mold)
bga8 Packaging Capability and Assembly Services | UTAC LTCC BGA [Embedded Passives]
bga9 Packaging Capability and Assembly Services | UTAC MEMS LGA

Package Options:

 

  • Stacked Die, Multi die side by side or Package Stacking,
  • Gold or Pd/Cu Wire
  • Thermal Enhancement with heatspreaders, thick copper, thermal conductive mold compounds.
  • Shielded BGA's
  • Land Grid Arrays
  • Window CSP options for DRAM packaging
Package Body Size Ball Count Ball Pitch
BGA 9x9 to 40x40mm 64 to 622 1.00 to 1.50mm
FBGA 3x3 to 21x12mm 16 to 625 0.40 to 0.80mm
PBGA 11x11 to 35x35mm 84 to 388 1.00 to 1.50mm
XPBGA 15x15 to 31x31mm 196 to 1444 1.00 to 1.27mm

Note: Please check with UTAC Sales team for any package variations not in the list

Memory Packages

UTAC has expanded its service with its System-in-Package experience to offer solutions not just in package form, but non-standard IC package as modules. With its strength in memory assembly and test services, UTAC widens its services to include DIMM (Dual-In-Line Memory Module) and memory cards assembly and test with greater demand of portable storage requirement.

 

1. Memory Card

 

UTAC offers various formata for card assembly and test services. This includes MMC, RSMMC and the entire range of small form factor memory cards including custom designed memory cards.

 

Features:

 

  • Multi chip processing using wire bond side by side or stacked die concept. Flip chip processing capable.
  • Capability of mounting up to 01005 components with in line AOI inspection.
  • Capability of placing card into plastic housing or advanced sawing processing for SDA or MMCA packaging compliance.
  • Supports full testing for Flash memory card with various program libraries available.

 

Applications:

 

  • Storage card for computer, optical, or handheld devices.

 

2. DIMM (Dual In-Line Memory Module) (UTAC):

 

DIMM, or dual in-line memory module comprises a series of random access memory integrated circuits. These modules are mounted on a PCB or Printed Circuit Boards with passive components and end application is for use in Computers.

 

Features:

 

  • Full assembly infrastructure to support DIMM Module assembly.
  • Capability of mounting 0201 / 01005 components with in line AOI inspection.
  • Ability to mount TSOP or BGA IC packages on DIMM module.
  • Full in line inspection ready from Solder paste printing (SPI inspection) to AOI (automated outgoing inspection) for DIMM module.
  • Supports full programming (SPD) and functional testing (MFT Mother board testing) of DIMM module.
  • Integrated card Singulation with laser cut and saw process.
  • Availability of open tool substrate for different types of Flash and micro-Controllers.

 

Applications:

 

  • Random Access Memory for Personal Computers

 

3. Window CSP

 

UTAC wCSP is a high performance, cost effective chip scale BGA package developed for high speed memory applications. Its state of the art packaging design enables effective package miniaturization compared to conventional TSOPs. The package design accommodates die shrinks without affecting package outline. This allows the customer a seamless transition when migrating to next generation of memory chips of smaller design rule or high memory density. The wCSP is available in various package size and ball count. The standard package height is 1.2mm max.

 

Features:

 

  • Ball pitches from 0.8 to 1.0mm.
  • Low profile, 1.2mm maximum height
  • Eutectic or Pb Free solderballs
  • Package body size from 8x9 to 12.5x12.5
  • JEDEC Standard Compliant

 

Applications:

 

  • SDR / DDR / DDR2 / Low Power DRAMS

Wafer Level Packages

Wafer Level Services

Wafer level services are available in various UTAC manufacturing locations. We support 200 / 300mm wafers up to 40nm ULK wafer nodes. UTAC can support a wide range of package sizes with bump pitch of 250um for a 150um bump diameter. Backside Surface Protection is an available option for our customers. We offer full turnkey solution from wafer probing, packaging to drop shipment arrangements. UTAC has in house second level reliability testing to support customer's qualification requirements.

 

Features:

 

  • Die size from below 1x1mm
  • Backside Surface Protection option is available
  • Capable to process ULK devices up to 40nm wafer technology

 

28nm-wlcsp Packaging Capability and Assembly Services | UTAC 28nm WLCSP/BGA (min Si thickness : 250um)
  Current Capability 2016 2017
Wafer Size 8” and 12” wafer
Low K Capability 65nm, 40nm, 28nm 16 nm
Die Size Support 1.2 mm ~ 7 mm 0.8 mm ~ 15 mm
Wafer Thinning 150 um 125 um
WLP Protection

BSP 25um thickness

IR/Non IR BSP Tape

Side Wall Protection
2-in-1 Tape - Thin Wafer                                         
Laser Mark

Wafer ID Marking,

XY Coordinate Marking

Mark Through Tape  
2-in-1 Tape - Thin Wafer  
Wafer Singulation Mechanical Dicing / Laser Groove Wide Beam Capable Stealth Dicing
Post Saw Control / AOI Automated Post Saw Inspection  
Tape & Reel
(PnP & Testing
Integration)
Automated 5-sided (5S) inspection Enhanced Automated
Post Seal Inspection (ePSI)
 
Dual Bin Capable Integrated Unit Laser
Marking – Thin wafer
 
Integrated Open/Short Test with 5S inspection Automated Full Functional Test with 5S
Reliability Monitoring Reel to Reel Automated  
5-sided Inspection  
Reel to Reel Full Functional Test  
 
Color Key: Production Mode Engineering Mode

Wafer Level Process Capability

Thru Silicon Stacking

UTAC has been working on Thru Silicon Stacking (TSS) since 2007. UTAC has set up TSS capabilities in corporate headquarters located in Singapore. UTAC has established capability for stacking up to 4 dice. In addition, UTAC is a member of IMEC TSV 3D IC and IME TSV consortium for which UTAC has been supporting stacking and back end assembly process.


Qualified packages:

 

  • D2-TSI-fcBGA with Heatsink (42.5x42.5mm package size)
  • D2-TSI-fcCSP (13x13mm package size)

Smart Cards

About Smart Card Module and Flip Chip Inlay Assembly

The smart card module assembly and flip chip inlay manufacturing lines can support a variety of end market applications including financial, banking, government, health, retail, transportation and telecoms. Our high volume manufacturing capability can support a range of contact, contactless, and dual-interface modules for smart cards, as well as contactless RFID tags. More than 50% of our factories are EAL 6 Site Certified per the Common Criteria and EMVCo industry standards and our modules have been CQM certified as required by the smart card banking industry.

 

End Markets We Serve

 

identity
Government / Identity / Health
banking Packaging Capability and Assembly Services | UTAC
Financial / Banking
telecoms Packaging Capability and Assembly Services | UTAC
Telecoms
retail Packaging Capability and Assembly Services | UTAC
Retail

 

 

Smart Card IC Module Assembly Features

  • 8” and 12” Wafer
  • Contact C6 & C8, Contactless, Dual Interface, and RFID Tag Modules
  • Reel to Reel Production Line
  • 35mm Leadframe Tape and Epoxy Glass Tape
  • Wire Bond: Au Wire 0.7 mils and 1.0 mil
  • Transfer Molding, Dam & Fill, Glob Top
  • Wafer / Die thickness range: 0.1mm to 0.15mm
  • Encapsulation Module Thickness .25mm to .58mm
  • Package Module Size Range: 5x8mm to 14x14mm
  • Non-Conductive Paste and Conductive Paste
  • Globtop and Dam & Fill machines with in-line 100% thickness inspection
  • Proven bill of materials that Pass CQM & ISO Reliability standards for both module and card level

 

ft1 Packaging Capability and Assembly Services | UTAC
ft2 Packaging Capability and Assembly Services | UTAC
ft3 Packaging Capability and Assembly Services | UTAC

 

asb-tree Packaging Capability and Assembly Services | UTAC

 

Contactless, Dual Interface and Epoxy Tag Module Examples in High Volume Production

 

module1 Packaging Capability and Assembly Services | UTAC
ContactlessDetails
Encapsulation Method Transfer Molding
Encapsulation Size 5.1 x 4.9 mm
Module Size 5.0 x 8.0 mm
Module thickness 0.25 – 0.33 mm
Die thickness 0.110 mm
Application Transportation payment cards.

 

module2 Packaging Capability and Assembly Services | UTAC
UV Dam & Fill Dual InterfaceDetails
Encapsulation Method UV Dam & Fill (or Molding)
Encapsulation Size 8.5 x 7.4 mm
Module Size 12.6 x 11.4 mm
Module thickness 0.58 mm
Die thickness 0.150 mm
Application Banking cards
module3 Packaging Capability and Assembly Services | UTAC
Epoxy TagDetails
Encapsulation Method Dam & Fill
Encapsulation Size 4.5 x 5.8 mm
Module Size 14 x 14 mm
Module thickness 0.6 mm
Die thickness 0.150 mm
Application RF Tag

 

Contact Modules with Various Encapsulation Methods in High Volume Production

 

module4 Packaging Capability and Assembly Services | UTAC
Contact 6Details
Encapsulation Method Transfer Molding
Encapsulation Size 6.1 x 6.1 mm
Module Size 10.8 x 8.2 mm
Module thickness 0.56 mm
Die thickness 0.150 mm
Application Banking cards, PayTV.

 

Contact 8Details
Encapsulation Method Transfer Molding
Encapsulation Size 7.7 x 7.7 mm
Module Size 13.0 x 11.8 mm
Module thickness 0.58 mm
Die thickness 0.150 mm
Application Banking cards, PayTV.

 

module5 Packaging Capability and Assembly Services | UTAC
UV Globtop Contact 6Details
Encapsulation Method Globtop
Encapsulation Size Diameter 6.3 – 8.0 mm
Module Size 10.6 x 8.0 mm
Module thickness 0.48 – 0.58mm
Die thickness 0.150 mm
Application 3G & 4G SIM Cards

 

IC Module Assembly Inline Monitoring

 

EnvironmentalTest DescriptionInterval CheckTest Criteria
Chemical Resistance Test Soak in mixed solution 5% NaCl + 95% Water for one minute at 25°C 1 minute / 6 month Functional Test
High Temperature Storage 125°C Unlimited Hours (500 hours is Common) 500 hrs / 6 months Functional Test
Pressure Cooker Test Capability 48 Hours @ 2x Atmospheric Pressure / 120°C / Relative Humidity 100% 48 hrs / 6 months Functional Test
Temperature and Humidity Test Capability 85°C / 85% RH; 500 Hours 500 hrs / 6 months Functional Test
Temperature Cycling Capability -40°C to 80°C (120°C delta) or,
-55°C to 85°C (140°C delta)
Unlimited Cycles (100 Cycles is Common)
100 cycle / 6 months Functional Test

Flip Chip Inlay Assembly Features

  • 8” and 12” Wafer
  • Contactless
  • In-line production flow
  • In-line vision inspection and unique ID (open / short) test
  • High frequency and ultra high frequency Inlay antenna
  • Die size 0.3 mm to 0.4mm
  • Die thickness 0.75 mm to 0.3 mm
  • Inlay antenna sheet 80mm to 400mm
  • Anisotropic Conductive Paste

 

flip-chip1 Packaging Capability and Assembly Services | UTAC
flip-chip2 Packaging Capability and Assembly Services | UTAC
flip chip3
flip-chip-inlay Packaging Capability and Assembly Services | UTAC

 

 

Flip Chip Inlay Inline Monitoring

 

EnvironmentalTest Description & Range of ConditionsInterval CheckTest Criteria
Temperature Cycling Capability -40°C / 85°C (125°C delta) 100 Cycles 100 cycle / 6 months Functional Test
Temperature and Humidity Test Capability Example 85°C / 85% Relative Humidity; 1000 Hours or,
121°C / 100% Relative Humidity; 168 Hours
Every 6 months Functional Test
High temperature Storage Example 100°C for 168 Hours 168 hrs / 6 months Functional Test
Cold Test -20°C; 1000 Hours 1000 hrs / 6 months Functional Test

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