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Packaging Solutions

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UTAC has a diverse capability spanning across ten factories in six countries in the Asia Pacific region. Packaging capability includes Leadless Packages, Wafer Level Packages, System in Package (SiP), Laminate Packages, Leaded Packages and Security Smart Card Module and Smart Card Inlay.


We integrate our service offerings to provide customers full-turnkey manufacturing solutions, including: wafer probe, wafer processing, assembly, test, black-box encryption and direct shipment as designated by our customers. Additionally, we have established service partners to enhance our value offerings and provide seamless support to customers which include Bump, FAN-In and FAN-Out WLCSP, 3D Embedded Substrate Manufacturing and Burn-In.


Production capability at UTAC can support technology nodes up to 28nm and we can support 150mm, 200mm and 300mm wafer diameters in high volume production. All wire types and a wide range of wire diameter is running in high volume production today ranging from .6 mils to 2mils, Au, Pd Cu, Bare Cu, Au Alloy, Ag Alloy and AuPdCu.


Our solutions include 3D- SiP, Cu Clip, MEMS, Thin QFN, Multi-Row and/or Array, WLCSP Side Wall Protection, Side Lead Plating inspectable joint (automotive grade accepted) and Security EAL 6 assembly.

Embedding of active die into substrate (in addition to passive components) to enable miniaturization through 3D assembly. UTAC partnered with leading supplier of embedded substrates to provide seamless turnkey solution from design to end of line. Using this solution can provide many benefits including:


  • Improved power, electrical and thermal efficiency
  • Two side cooling, shorter interconnects, power / ground planes.
  • Integration of RF and digital devices with isolation

Trend to 3D SiP w/ Embedded Chip

Packaging Capability Solutions

3D SiP Supply Chain Collaboration

Packaging Capability Solutions and Strategic Supply Chain Partners

Copper Clip is a favorable replacement for traditional wire bond interconnection used for high performance MOSFETs. UTAC is in volume production for a variety of Cu Clip packages in support of leading IDM’s in the market.

UTAC Provides Fully Automated Assembly System with Thin Wafer Mount / Taiko Ring Cut & Removal.

Target End Applications Include Industrial (High-End Computing Server / Data Centers) and Automotive.

UTAC clip line configuration is suitable for multi chip / muli die configuration MOSFETs Dr MOS.

Cu Clip provides significant performance advantages allowing for higher current, higher frequency and better overall system efficiency:


  • Lower interconnect resistance and inductance
  • Lower spreading resistance
  • Improved current handling capability
  • Improved transient and steady state thermal performance

Cu Clip QFN
Module 2 FET + Clip + Controller


Cu Clip Package Offerings (Multichip)
Discrete Cu Clip QFN Stacked Cu Clip Module QFN Stacked Cu Clip Dual- Die QFN
Cu-Clip-Package-Offerings-Multichip-Picture1 Packaging Solutions | UTAC Group Cu-Clip-Package-Offerings-Multichip-Picture2 Packaging Solutions | UTAC Group Cu-Clip-Package-Offerings-Multichip-Picture3 Packaging Solutions | UTAC Group
Cu-Clip-Package-Offerings-Multichip-Picture4 Packaging Solutions | UTAC Group Cu-Clip-Package-Offerings-Multichip-Picture5 Packaging Solutions | UTAC Group Cu-Clip-Package-Offerings-Multichip-Picture6 Packaging Solutions | UTAC Group


Turnkey Assembly & Test Solution in Thailand

Package QFN Cu Clip
Body Size Range 3.5 x 4.5 to 10 x 12 mm
Lead Count Range  
Number of IC’s Range 1 to 3
Number of MOSFETs Range Up to 2
Number of Clips Range 1 to 3
Die Configuration Flexible Design (Stack or Side by Side)
Wire Type Range AuPdCu 1.0 to 1.5 mil
Au 1.0 to 1.5 mil

UTAC has been in production of MEMS sensor packages since 2005 starting with simple oscillators in QFN package in the range of 2x2 – 7x7. By 2010, MEMS became a strategic focus for UTAC, over the last six years we have developed and ramped several MEMS device packages such as: QFN, LGA, fcQFN, fcLGA, GQFN, Cavity QFN w/ Lid Attached. The types of MEMS devices running in production include oscillators, Magnetometer, Accelerometer, Gyroscope, and RF Tuners.

Our research and development teams work closely with customers to ensure that the package design and the bill of material selected to support the unique structure is both robust and optimized.



Current package types are running in high volume production for MEMS products in a assortment of body sizes, wire types, formfactor and multi-die designs.

UTAC R&D teams work closely with customers to ensure that the package design and the bill of materials selected to support the unique structure is optimized, robust and manufacturable.

MEMS devices running in high volume production include Oscillators, Magnetometer, Accelerometer, Gyroscope, Pressure, Thermometer and RF Tuners.

Enabling Cavity Package MEMS in support of Inertial, Pressure and Temperature Sensors Enabling Materials & Processes for MEMS Unique Structure Enabling Interposer Solutions for MEMS
  • Cavity Lid :
    • Material Selection and Properties
    • Plating Type
    • Pre-fabricated
  • Lid Attach Equipment can Support Glass, Plastic and Metal Lid Requirements
  • Multi-die Bonder can Support Precise Die Attach and Multi-Die Attach Requirements

Process :

  • Wafer Prep - Wafer Thinning
  • Die Attach - Thick BLT Control and Bleed using Silicone Materials
  • Wirebonding - on soft adhesives
  • Compression Mold for lower stress

Materials :

  • Die Coating – Protect MEMS Device for Oscillator Applications
  • Film Over Wire
  • Low Stress Materials - Die attach & Mold compound

Interposers :

  • Laminate Package - Coreless Technology
  • Routable QFN - Leadframe based
  • Leadframe - Standard Gull Wing
  • Ceramic - 2 Layers and Above

Wafer level services are available in various UTAC manufacturing locations. We support 200 / 300mm wafers up to 40nm ULK wafer nodes. UTAC can support a wide range of package sizes with bump pitch of 250um for a 150um bump diameter. Backside Surface Protection is an available option for our customers. We offer full turnkey solution from wafer probing, packaging to drop shipment arrangements. UTAC has in house second level reliability testing to support customer's qualification requirements.




  • Die size from below 1x1mm
  • Backside Surface Protection option is available
  • Capable to process ULK devices up to 40nm wafer technology


 Current Capability20162017
Wafer Size 8” and 12” wafer
Low K Capability 65nm, 40nm, 28nm 16 nm
Die Size Support 1.2 mm ~ 7 mm 0.8 mm ~ 15 mm
Wafer Thinning 150 um 125 um
WLP Protection

BSP 25um thickness

IR/Non IR BSP Tape

Side Wall Protection
2-in-1 Tape - Thin Wafer                                         
Laser Mark

Wafer ID Marking,

XY Coordinate Marking

Mark Through Tape  
2-in-1 Tape - Thin Wafer  
Wafer Singulation Mechanical Dicing / Laser Groove Wide Beam Capable Stealth Dicing
Post Saw Control / AOI Automated Post Saw Inspection  
Tape & Reel
(PnP & Testing
Automated 5-sided (5S) inspection Enhanced Automated
Post Seal Inspection (ePSI)
Dual Bin Capable Integrated Unit Laser
Marking – Thin wafer
Integrated Open/Short Test with 5S inspection Automated Full Functional Test with 5S
Reliability Monitoring Reel to Reel Automated  
5-sided Inspection  
Reel to Reel Full Functional Test  
Color Key: Production Mode Engineering Mode

Wafer Level Process Capability

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