Package Characterization

UTAC Thermal Analysis Overview

UTAC R&D has been established for more than 10 years and has developed strong thermal analysis expertise, broad range of thermal simulation capabilities, measurement facilities and amassed over 600 thermal analysis reports. Thermal analysis is available for a wide array of packages and system ranging from Multi-chip, system in a package (SiP), memory, power application, analog, mixed signal, wireless communication, etc.

UTAC Thermal Simulation And Measurement Tools And Services

UTAC has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers’ needs, as summarized in Fig.1 and Fig.2. UTAC team is dedicated to deliver timely and quality solutions to best meet customers’ increasing challenging packaging needs.

UTAC Mechanical Analysis Overview

UTAC R&D has amassed wealth of knowledge and experience both in theoretical simulation study as well as experimental/characterization at package level and board level. Numerous analysis have been conducted for a myriad of packages with extensive library technical reports. UTAC continuously expand its experience to include advance and cutting-edge package technologies.

UTAC Mechanical Simulation And Measurement Tools And Services

UTAC extensive mechanical analysis and characterization/measurement is summarized in Fig.1. It includes the analysis of the package and board level quality and reliability. UTAC team is dedicated to deliver timely and quality solutions to best meet customers’ increasing challenging packaging needs.

UTAC Electrical Analysis Overview

UTAC offers a wide array of packages ranging from memory, power application, analog, mixed signal, wireless communication packages etc. Each packages would have specific electrical requirements in signal integrity and power integrity. It is critical to have appropriate electrical modelling and characterization capabilities to ensure that the package offered can meet the requirements. UTAC has the know-how and extensive electrical simulation and characterization capabilities to meet the increasing demand and requirements of our array of packages, including advanced packages. Electrical analysis is involved in pre-layout design guideline, design optimization, all the way to package performance verification and failure analysis.

UTAC Electrical Simulation And Measurement Tools And Services

UTAC has comprehensive electrical analysis and measurement/characterization capabilities that cover a wide range of customer’s need as can be seen in Fig.1. The simulation capabilities include, but not limited to, 2-D, 3-D, full wave simulation in time and frequency domain.

UTAC Moldflow Analysis Overview

UTAC has a comprehensive suite of advanced analysis tools to offer a wide variety of analysis services specially designed to meet our customers’ needs. Simulation and validation services are available for a wide array of packages ranging from memory, power application, analog, mixed signal, wireless communication packages etc.

Increasing challenges to ensure moldability with rapid advances in flip-chip technology such as decreasing bump pitch and stand-off height, especially when commercial Moldable Underfill (MUF) is used and in particular, during panel level molding. One key challenge is severe void entrapment under the die. Experiments involving a large DOE matrix, which require significant time and resources, are typically used to solve the issue. 3D moldflow simulation can be used to optimize the design, material and process to reduce defects, cutting down the DOE matrix for experiments. Moldflow simulation can effectively shorten the design-to-implementation cycle time, identifying key problems before actual fabrication.