At UTAC we offer a wide range of semiconductor assembly services to meet our customers’ needs and the increasing market demand for next generation devices. UTAC has a diverse capability spanning across nine factories, in five countries in the Asia Pacific region. Our packaging capability includes Leadless Packages, Wafer Level Packages, System in Package (SiP), Laminate Packages, Leaded Packages and Security Smart Card Module and Smart Card Inlay.

To complement our packaging solutions we have state of the art design and package characterization capabilities to help our customers achieve both performance and cost objectives.

Our engineering teams collaborate closely with customers to understand the performance requirements and utilize our proprietary calculators and design tools to accelerate the package design phase.

Once the design is approved, we use a proven project management methodology to facilitate the new product introduction, taking the product through a rigorous phase gate process to ensure first time qualification.