Packaging Capability and Assembly Services

Image Sensor Packages

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Ceramic Based Image Sensor Package Portfolio

PACKAGE RANGE CLGA CLCC iBGA
Package Size 10×11 to 27.25×27.37 mm 7×7 to 10×12 mm 9×8 mm
Pin Count 74 to 241 38 to 46 63 B
Substrate Thickness 1.3 to 1.95 mm 1 mm 0.276 mm
Glass Thickness 0.3 to 0.7 mm 0.3 to 0.5 mm 0.5 mm
Package Height 1.6 to 2.68 mm 1.3 to 1.5 mm 1.435 to 1.501 mm
Seal Width 0.6 to 1.33 mm up to 0.43 mm 0.350mm (1 cavity)
Max Chip size 10×11 PKG: 7×8 Chip 7×7 PKG: 4×6 Chip 9.0×8.0 PKG: 7.5×5.5 Chip
27×27 PKG: 22.5×22.7 Chip 10×12 PKG: 7×9 Chip
Chip Thickness 0.3 to 0.65 mm 0.2 to 0.3 mm 0.200mm
Note: Customer Specific Note: Customer Specific Note: Customer Specific
Wire Type Au Au Au 4N
Wire Diameter (um) 17.5 to 25.4 um 17.5 to 22.5 um 25.4 um
Number of Wires 103 to 414 26 to 67 70

Image Sensor Package Production and Development Roadmap

  • UTAC is running high volume image sensor assembly and test for Industrial, Consumer and Automotive applications in support of Tier One Customers.
  • Class 10 Cleanroom Environment supports the high quality requirements and both 8” and 12” wafers can be mass processed.
  • UTAC Engineers have been working to develop the next generation of Image Sensor Packages to support the ever growing use of cameras.
  • Next generation Image Sensor Packages includes a migration to smaller formfactor, optimized substrate design and alternative bill of materials to address specific material lead-times.

Image Sensor Package Production and Development Roadmap