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Packaging Capability and Assembly Services
Image Sensor Packages
Ceramic Based Image Sensor Package Portfolio
| PACKAGE RANGE | CLGA | CLCC | iBGA |
| Package Size | 10×11 to 27.25×27.37 mm | 7×7 to 10×12 mm | 9×8 mm |
| Pin Count | 74 to 241 | 38 to 46 | 63 B |
| Substrate Thickness | 1.3 to 1.95 mm | 1 mm | 0.276 mm |
| Glass Thickness | 0.3 to 0.7 mm | 0.3 to 0.5 mm | 0.5 mm |
| Package Height | 1.6 to 2.68 mm | 1.3 to 1.5 mm | 1.435 to 1.501 mm |
| Seal Width | 0.6 to 1.33 mm | up to 0.43 mm | 0.350mm (1 cavity) |
| Max Chip size | 10×11 PKG: 7×8 Chip | 7×7 PKG: 4×6 Chip | 9.0×8.0 PKG: 7.5×5.5 Chip |
| 27×27 PKG: 22.5×22.7 Chip | 10×12 PKG: 7×9 Chip | ||
| Chip Thickness | 0.3 to 0.65 mm | 0.2 to 0.3 mm | 0.200mm |
| Note: Customer Specific | Note: Customer Specific | Note: Customer Specific | |
| Wire Type | Au | Au | Au 4N |
| Wire Diameter (um) | 17.5 to 25.4 um | 17.5 to 22.5 um | 25.4 um |
| Number of Wires | 103 to 414 | 26 to 67 | 70 |
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Image Sensor Package Production and Development Roadmap
- UTAC is running high volume image sensor assembly and test for Industrial, Consumer and Automotive applications in support of Tier One Customers.
- Class 10 Cleanroom Environment supports the high quality requirements and both 8” and 12” wafers can be mass processed.
- UTAC Engineers have been working to develop the next generation of Image Sensor Packages to support the ever growing use of cameras.
- Next generation Image Sensor Packages includes a migration to smaller formfactor, optimized substrate design and alternative bill of materials to address specific material lead-times.
Image Sensor Package Production and Development Roadmap
