Packaging Capability and Assembly Services

Laminate Packages

Click any of the services to learn more.

System in Packages (SiP)

With the ever increasing demand for a more cost effective form factor reduction, demand for SiP has also increased. UTAC offers various SiP solutions depending on our customer’s requirements by integrating various components in the package. These may include passive components, saw filters, prepackaged IC’s and EMI shieldings. UTAC is committed to provide the best SiP solution for our customer’s needs.

Advantages

  • Cost effective SoC alternative
  • Reduced Package footprint
  • Allows mixed IC technologies that can be separately optimized
  • Design flexibility
  • Shorter development time and cost
  • Faster time to market

LGA-SiP (Multichip RF)

SiP QFN

Special Components / P in P (CUF / MUF)

8-Die Stacking (0.9mm Mold Cap)

GQFN-SiP

fcBGA SiP (Solder)

Packaging Options

  • Available in Laminate or Leadframe based packages
  • Multi Die Configuration (Side by side or Stacked wirebond die)
  • Passive component integration including EMI Shielding
  • Capable up to 01005 chip component
  • Package in Package option available
  • Thermal Enhancement with Heatspreader option

eMMC (embedded multimedia card)

USB/ UDP Driver

QFN/ GQFN

BGA/LGA

BGA (Ball Grid Arrays / Land Grid Arrays)

UTAC offers various versions of BGA packages either in array, pocket molded or dam and fill configurations.

Package Features:

  • Material Construction of BT or Polyimide tape
  • Thru hole or build up multilayer construction
  • 0.40, 0.50, 0.65,0.80,1.00 and 1.27mm pitch available
  • Halogen free and RoHS compliant bill of materials
  • Various solder alloy for standard and leadfree applications

XP-FBGA (0.95 mm mold)

PBGA

MEMS LGA

Package Options:

  • Stacked Die, Multi die side by side or Package Stacking,
  • Gold or Pd/Cu Wire
  • Thermal Enhancement with heatspreaders, thick copper, thermal conductive mold compounds.
  • Shielded BGA’s
  • Land Grid Arrays
  • Window CSP options for DRAM packaging
Package Body Size Ball Count Ball Pitch
BGA 9×9 to 40x40mm 64 to 622 1.00 to 1.50mm
FBGA 3×3 to 21x12mm 16 to 625 0.40 to 0.80mm
PBGA 11×11 to 35x35mm 84 to 388 1.00 to 1.50mm
XPBGA 15×15 to 31x31mm 196 to 1444 1.00 to 1.27mm

Note: Please check with UTAC Sales team for any package variations not in the list

Memory Packages

UTAC has expanded its service with its System-in-Package experience to offer solutions not just in package form, but non-standard IC package as modules. With its strength in memory assembly and test services, UTAC widens its services to include DIMM (Dual-In-Line Memory Module) and memory cards assembly and test with greater demand of portable storage requirement.

1. Memory Card
UTAC offers various formata for card assembly and test services. This includes MMC, RSMMC and the entire range of small form factor memory cards including custom designed memory cards.

Features:

  • Multi chip processing using wire bond side by side or stacked die concept. Flip chip processing capable.
  • Capability of mounting up to 01005 components with in line AOI inspection.
  • Capability of placing card into plastic housing or advanced sawing processing for SDA or MMCA packaging compliance.
  • Supports full testing for Flash memory card with various program libraries available.

Applications:

  • Storage card for computer, optical, or handheld devices.

 

2. DIMM (Dual In-Line Memory Module) (UTAC):
DIMM, or dual in-line memory module comprises a series of random access memory integrated circuits. These modules are mounted on a PCB or Printed Circuit Boards with passive components and end application is for use in Computers.

Features:

  • Full assembly infrastructure to support DIMM Module assembly.
  • Capability of mounting 0201 / 01005 components with in line AOI inspection.
  • Ability to mount TSOP or BGA IC packages on DIMM module.
  • Full in line inspection ready from Solder paste printing (SPI inspection) to AOI (automated outgoing inspection) for DIMM module.
  • Supports full programming (SPD) and functional testing (MFT Mother board testing) of DIMM module.
  • Integrated card Singulation with laser cut and saw process.
  • Availability of open tool substrate for different types of Flash and micro-Controllers.

Applications:

  • Random Access Memory for Personal Computers

 

3. Window CSP
UTAC wCSP is a high performance, cost effective chip scale BGA package developed for high speed memory applications. Its state of the art packaging design enables effective package miniaturization compared to conventional TSOPs. The package design accommodates die shrinks without affecting package outline. This allows the customer a seamless transition when migrating to next generation of memory chips of smaller design rule or high memory density. The wCSP is available in various package size and ball count. The standard package height is 1.2mm max.

Features:

  • Ball pitches from 0.8 to 1.0mm.
  • Low profile, 1.2mm maximum height
  • Eutectic or Pb Free solderballs
  • Package body size from 8×9 to 12.5×12.5
  • JEDEC Standard Compliant

Applications:

  • SDR / DDR / DDR2 / Low Power DRAMS