Leadframe Packages

Click any of the services to learn more.

QFN Cu Clip
QFN, DFN, and Dual-row QFN
GQFN
TLA
QFP
DIP
SOIC/SSOP/QSOP
TSSOP
MSOP
SOT/SC

QFN Cu Clip

Copper Clip is a favorable replacement for traditional wire bond interconnection used for high performance MOSFETs. UTAC is in volume production for a variety of Cu Clip packages in support of leading IDM’s in the market.

UTAC Provides Fully Automated Assembly System with Thin Wafer Mount / Taiko Ring Cut & Removal.

Target end applications include Industrial (high-end computing server / data centers) and telecom infrastructure, laptop, graphics card and automotive.

UTAC clip line configuration is suitable for multi chip / muli die configuration MOSFETs Dr MOS and Smart power stage products.

Cu Clip provides significant performance advantages allowing for higher current, higher frequency and better overall system efficiency:

Lower interconnect resistance and inductance
Lower spreading resistance
Improved current handling capability
Improved transient and steady state thermal performance

Turnkey Assembly & Test Solution in Thailand

PACKAGE	QFN CU CLIP
Body Size Range	3.5 x 4.5 to 5 x 7mm
Lead Count Range	8 to 41Ld
Number of IC’s Range	1 to 3
Clip Thickness	5/6/8/10mil
Die Configuration	Flexible Design (Stack or Side by Side)
Wire Type Range	AuPdCu 1.0 to 1.5 mil Au 1.0 to 1.5 mil

QFN, DFN, and Dual-row QFN

The QFN (Quad Flat No-Lead) package is a popular and cost effective plastic package which was introduced by UTAC in 1998, adding a leadless concept into UTAC’s expanding portfolio. The package is a superior choice for high speed applications where thermal and electrical performance is paramount and space constraint is unavoidable. For thermal solutions, it has the ability to mount the die attach pad directly to the board for heat dissipation.

UTAC has a variety of advanced options that enable the QFN package to be introduced to a variety of end product applications in the automotive and consumer space.

Package Thickness options: 0.33, 0.40, 0.50, 0.55, 0.80, 0.90, 1.00mm maximum
Halogen free and RoHS Bill of material
Bond Wire: Au, AuPdCu, PdCu and Bare Cu Wire
Lead finish options: Matte Tin, PPF
Advanced options: Stacked die, MCM side by side, Flip-Chip with Cu Pillar & solder ball, SiP, Solderable sidewall (SLP) & Tin , Wettable Flank PPF
In development: Air Cavity, 0.25mm maximum thickness

QFN single row

Expose Die fcQFN

Top Expose Pad QFN

QFN dual row

Flip Chip QFN

BODY SIZE	TERMINAL PITCH	TERMINAL COUNT
0.6 x 1.0	0.50	2, 3
1.13 x 1.1	0.50	6
2 x 2	0.50	8,10
3 x 3	0.40, 0.50, 0.65	8 to 20
4 x 4	0.40, 0.50, 0.65	12 to 28
4 x 5	0.50	24, 28
5 x 5	0.40, 0.50, 0.65	20 to 40
5 x 6	0.65	22
5 x 7	0.50	38
6 x 6	0.40, 0.50, 0.65	24 to 48
7 x 7	0.40, 0.50, 0.65	32 to 56
8 x 8	0.40, 0.50, 0.65	36 to 68
9 x 9	0.40, 0.50, 0.65	44 to 76
10 x 10	0.40, 0.50	68 to 88
12 x 12	0.50	80
14 x 14	0.50	100

GQFN

In line with it’s legacy of introducing innovative packaging solutions, UTAC offers a wide variety of multi row leadframe based leadless packaging solutions. This includes various leadframe fabrication technologies such as etch through, double half etch and metal build up. These advanced leadframe packages provide a high I/O density and smaller footprint compared to most leadframe based package technologies. Most designs are fully customizable and enables manufacturers to shrink die sizes and benefit from the latest fab technology.

Package Features

Package can be designed around the die
0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
Overall package thickness down to 0.33 max
Optional package standoff that provides self centering during SMT process
Strip level testing (no additional process required)
Bussless design with no exposed copper on sidewalls
Routable traces

GQFN (PPF)

GQFN with Solder coat or Ball Attach

Advanced Options

Stacked die, MCM, Flip Chip option and System in package

GQFN-SiP

PACKAGE	BODY SIZE	I/O	PITCH
GQFN	2×2 to 13x13mm	24 to 268	0.40 to 0.65mm

TLA

Package Features

Package can be designed around the die
0.40, 0.50 and 0.65mm pitch available. Other pitch are also possible
Overall package thickness down to 0.33 max
Optional package standoff that provides self centering during SMT process
Strip level testing (no additional process required)
Bussless design with no exposed copper on sidewalls

Advanced Options

Stacked die, MCM, Flip Chip option and System in package

PACKAGE	BODY SIZE	I/O	PITCH
TLA	4×4 to 17x17mm	20 to 348	0.40 to 0.65mm

QFP

UTAC offers a wide array of packages from MQFP, LQFP and TQFP’s in various body sizes and lead counts, body thicknesses and footprints. Open tooled lead frames are available for various die sizes. Custom leadframe designs are also supported. All QFP’s are assembled with Halogen free and RoHS compliant material set.

Thermal and electrical performance enhancements are possible with the following options:

Exposed Die Attach Pad

Options:

Stacked Die
Pd/Cu Bonding Wire

Lead Count	Package Type	Body Size	Lead Pitch
32	TQFP	7x7x1.0	0.8
48	TQFP	7x7x1.0	0.5
48	eTQFP	7x7x1.0	0.5
48	LQFP	7x7x1.4	0.5
48	eLQFP	7x7x1.4	0.5
64	TQFP	10x10x1.0	0.5
64	eTQFP	10x10x1.0	0.5
64	LQFP	10x10x1.4	0.5
64	eLQFP	10x10x1.4	0.5
44	QFP	10x10x1.95	0.8
64	LQFP	14x14x1.4	0.8
80	LQFP	14x14x1.4	0.65
100	LQFP	14x14x1.4	0.5
100	QFP	18x18x2.45	0.65
144	LQFP	20x20x1.4	0.5
144	eLQFP	20x20x1.4	0.5