Packaging Capability and Assembly Services

Contact Modules with Various Encapsulation Methods in High Volume Production

Smart Cards

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About Smart Card Module and Flip Chip Inlay Assembly

The smart card module assembly and flip chip inlay manufacturing lines can support a variety of end market applications including financial, banking, government, health, retail, transportation and telecoms. Our high volume manufacturing capability can support a range of contact, contactless, and dual-interface modules for smart cards, as well as contactless RFID tags. More than 50% of our factories are EAL 6 Site Certified per the Common Criteria and EMVCo industry standards and our modules have been CQM certified as required by the smart card banking industry.

End Markets We Serve

Government / Identity / Health

Financial / Banking

Telecoms

Retail

Smart Card IC Module Assembly Features

  • 8” and 12” Wafer
  • Contact C6 & C8, Contactless, Dual Interface, and RFID Tag Modules
  • Reel to Reel Production Line
  • 35mm Leadframe Tape and Epoxy Glass Tape
  • Wire Bond: Au Wire 0.7 mils and 1.0 mil
  • Transfer Molding, Dam & Fill, Glob Top
  • Wafer / Die thickness range: 0.1mm to 0.15mm
  • Encapsulation Module Thickness .25mm to .58mm
  • Package Module Size Range: 5x8mm to 14x14mm
  • Non-Conductive Paste and Conductive Paste
  • Globtop and Dam & Fill machines with in-line 100% thickness inspection
  • Proven bill of materials that Pass CQM & ISO Reliability standards for both module and card level

Contactless, Dual Interface and Epoxy Tag Module Examples in High Volume Production

CONTACTLESSDETAILS
Encapsulation MethodTransfer Molding
Encapsulation Size5.1 x 4.9 mm
Module Size5.0 x 8.0 mm
Module thickness0.25 – 0.33 mm
Die thickness0.110 mm
ApplicationTransportation payment cards.
UV DAM & FILL DUAL INTERFACEDETAILS
Encapsulation MethodUV Dam & Fill (or Molding)
Encapsulation Size8.5 x 7.4 mm
Module Size12.6 x 11.4 mm
Module thickness0.58 mm
Die thickness0.150 mm
ApplicationBanking cards
EPOXY TAGDETAILS
Encapsulation MethodDam & Fill
Encapsulation Size4.5 x 5.8 mm
Module Size14 x 14 mm
Module thickness0.6 mm
Die thickness0.150 mm
ApplicationRF Tag

Contact Modules with Various Encapsulation Methods in High Volume Production

CONTACT 6DETAILS
Encapsulation MethodTransfer Molding
Encapsulation Size6.1 x 6.1 mm
Module Size10.8 x 8.2 mm
Module thickness0.56 mm
Die thickness0.150 mm
ApplicationBanking cards, PayTV.
CONTACT 8DETAILS
Encapsulation MethodTransfer Molding
Encapsulation Size7.7 x 7.7 mm
Module Size13.0 x 11.8 mm
Module thickness0.58 mm
Die thickness0.150 mm
ApplicationBanking cards, PayTV.
UV GLOBTOP CONTACT 6DETAILS
Encapsulation MethodGlobtop
Encapsulation SizeDiameter 6.3 – 8.0 mm
Module Size10.6 x 8.0 mm
Module thickness0.48 – 0.58mm
Die thickness0.150 mm
Application3G & 4G SIM Cards

IC Module Assembly Inline Monitoring

ENVIRONMENTALTEST DESCRIPTIONINTERVAL CHECKTEST CRITERIA
Chemical Resistance TestSoak in mixed solution 5% NaCl + 95% Water for one minute at 25°C1 minute / 6 monthFunctional Test
High Temperature Storage125°C Unlimited Hours (500 hours is Common)500 hrs / 6 monthsFunctional Test
Pressure Cooker Test Capability48 Hours @ 2x Atmospheric Pressure / 120°C / Relative Humidity 100%48 hrs / 6 monthsFunctional Test
Temperature and Humidity Test Capability85°C / 85% RH; 500 Hours500 hrs / 6 monthsFunctional Test
Temperature Cycling Capability-40°C to 80°C (120°C delta) or,
-55°C to 85°C (140°C delta)
Unlimited Cycles (100 Cycles is Common)
100 cycle / 6 monthsFunctional Test

Flip Chip Inlay Assembly Features

  • 8” and 12” Wafer
  • Contactless
  • In-line production flow
  • In-line vision inspection and unique ID (open / short) test
  • High frequency and ultra high frequency Inlay antenna
  • Die size 0.3 mm to 0.4mm
  • Die thickness 0.75 mm to 0.3 mm
  • Inlay antenna sheet 80mm to 400mm
  • Anisotropic Conductive Paste

Flip Chip Inlay Inline Monitoring

ENVIRONMENTALTEST DESCRIPTION & RANGE OF CONDITIONSINTERVAL CHECKTEST CRITERIA
Temperature Cycling Capability-40°C / 85°C (125°C delta) 100 Cycles100 cycle / 6 monthsFunctional Test
Temperature and Humidity Test Capability Example85°C / 85% Relative Humidity; 1000 Hours or,
121°C / 100% Relative Humidity; 168 Hours
Every 6 monthsFunctional Test
High temperature Storage Example100°C for 168 Hours168 hrs / 6 monthsFunctional Test
Cold Test-20°C; 1000 Hours1000 hrs / 6 monthsFunctional Test