Contact Modules with Various Encapsulation Methods in High Volume Production
Packaging Capability and Assembly Services
Smart Cards
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- About Smart Card Module and Flip Chip Inlay Assembly
- Smart Card IC Module Assembly Features
- Flip Chip Inlay Assembly Features
About Smart Card Module and Flip Chip Inlay Assembly
The smart card module assembly and flip chip inlay manufacturing lines can support a variety of end market applications including financial, banking, government, health, retail, transportation and telecoms. Our high volume manufacturing capability can support a range of contact, contactless, and dual-interface modules for smart cards, as well as contactless RFID tags. More than 50% of our factories are EAL 6 Site Certified per the Common Criteria and EMVCo industry standards and our modules have been CQM certified as required by the smart card banking industry.
End Markets We Serve
Government / Identity / Health
Financial / Banking
Telecoms
Retail
Smart Card IC Module Assembly Features
- 8” and 12” Wafer
- Contact C6 & C8, Contactless, Dual Interface, and RFID Tag Modules
- Reel to Reel Production Line
- 35mm Leadframe Tape and Epoxy Glass Tape
- Wire Bond: Au Wire 0.7 mils and 1.0 mil
- Transfer Molding, Dam & Fill, Glob Top
- Wafer / Die thickness range: 0.1mm to 0.15mm
- Encapsulation Module Thickness .25mm to .58mm
- Package Module Size Range: 5x8mm to 14x14mm
- Non-Conductive Paste and Conductive Paste
- Globtop and Dam & Fill machines with in-line 100% thickness inspection
- Proven bill of materials that Pass CQM & ISO Reliability standards for both module and card level
Contactless, Dual Interface and Epoxy Tag Module Examples in High Volume Production
| CONTACTLESS | DETAILS |
|---|---|
| Encapsulation Method | Transfer Molding |
| Encapsulation Size | 5.1 x 4.9 mm |
| Module Size | 5.0 x 8.0 mm |
| Module thickness | 0.25 – 0.33 mm |
| Die thickness | 0.110 mm |
| Application | Transportation payment cards. |
| UV DAM & FILL DUAL INTERFACE | DETAILS |
|---|---|
| Encapsulation Method | UV Dam & Fill (or Molding) |
| Encapsulation Size | 8.5 x 7.4 mm |
| Module Size | 12.6 x 11.4 mm |
| Module thickness | 0.58 mm |
| Die thickness | 0.150 mm |
| Application | Banking cards |
| EPOXY TAG | DETAILS |
|---|---|
| Encapsulation Method | Dam & Fill |
| Encapsulation Size | 4.5 x 5.8 mm |
| Module Size | 14 x 14 mm |
| Module thickness | 0.6 mm |
| Die thickness | 0.150 mm |
| Application | RF Tag |
Contact Modules with Various Encapsulation Methods in High Volume Production
| CONTACT 6 | DETAILS |
|---|---|
| Encapsulation Method | Transfer Molding |
| Encapsulation Size | 6.1 x 6.1 mm |
| Module Size | 10.8 x 8.2 mm |
| Module thickness | 0.56 mm |
| Die thickness | 0.150 mm |
| Application | Banking cards, PayTV. |
| CONTACT 8 | DETAILS |
|---|---|
| Encapsulation Method | Transfer Molding |
| Encapsulation Size | 7.7 x 7.7 mm |
| Module Size | 13.0 x 11.8 mm |
| Module thickness | 0.58 mm |
| Die thickness | 0.150 mm |
| Application | Banking cards, PayTV. |
| UV GLOBTOP CONTACT 6 | DETAILS |
|---|---|
| Encapsulation Method | Globtop |
| Encapsulation Size | Diameter 6.3 – 8.0 mm |
| Module Size | 10.6 x 8.0 mm |
| Module thickness | 0.48 – 0.58mm |
| Die thickness | 0.150 mm |
| Application | 3G & 4G SIM Cards |
IC Module Assembly Inline Monitoring
| ENVIRONMENTAL | TEST DESCRIPTION | INTERVAL CHECK | TEST CRITERIA |
|---|---|---|---|
| Chemical Resistance Test | Soak in mixed solution 5% NaCl + 95% Water for one minute at 25°C | 1 minute / 6 month | Functional Test |
| High Temperature Storage | 125°C Unlimited Hours (500 hours is Common) | 500 hrs / 6 months | Functional Test |
| Pressure Cooker Test Capability | 48 Hours @ 2x Atmospheric Pressure / 120°C / Relative Humidity 100% | 48 hrs / 6 months | Functional Test |
| Temperature and Humidity Test Capability | 85°C / 85% RH; 500 Hours | 500 hrs / 6 months | Functional Test |
| Temperature Cycling Capability | -40°C to 80°C (120°C delta) or, -55°C to 85°C (140°C delta) Unlimited Cycles (100 Cycles is Common) |
100 cycle / 6 months | Functional Test |
Flip Chip Inlay Assembly Features
- 8” and 12” Wafer
- Contactless
- In-line production flow
- In-line vision inspection and unique ID (open / short) test
- High frequency and ultra high frequency Inlay antenna
- Die size 0.3 mm to 0.4mm
- Die thickness 0.75 mm to 0.3 mm
- Inlay antenna sheet 80mm to 400mm
- Anisotropic Conductive Paste
Flip Chip Inlay Inline Monitoring
| ENVIRONMENTAL | TEST DESCRIPTION & RANGE OF CONDITIONS | INTERVAL CHECK | TEST CRITERIA |
|---|---|---|---|
| Temperature Cycling Capability | -40°C / 85°C (125°C delta) 100 Cycles | 100 cycle / 6 months | Functional Test |
| Temperature and Humidity Test Capability Example | 85°C / 85% Relative Humidity; 1000 Hours or, 121°C / 100% Relative Humidity; 168 Hours |
Every 6 months | Functional Test |
| High temperature Storage Example | 100°C for 168 Hours | 168 hrs / 6 months | Functional Test |
| Cold Test | -20°C; 1000 Hours | 1000 hrs / 6 months | Functional Test |
