UTAC has reliability lab operations in every factory to support package and production qualification. This capability enables in-house customer support for both JEDEC / JEITA standards and for both Package and Product Qualification.
At UTAC, our quality organization is centralized, our QA engineers can seamlessly leverage laboratories/resources across multiple UTAC sites (if needed) allowing customers to take their products to market as quickly as possible.
Our Reliability labs are supported by a team of more than 10 engineering staff with average experience of more than 15 years
In-house capabilities are enhanced with the support of pre-approved, local reliability labs to provide additional services such as vibration and mechanical shock tests, as well as Burn-In test.
Reliability Tests
Click any of the services below to learn more. Click the arrows on the right to view more services.
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Moisture Sensitivity Level Soaking (MSL)
Temperature Humidity Bias Life Test (THB)
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Highly Accelerated Stress Test (HAST)
Unbiased HAST (uHAST)
Autoclave (PCT)
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Temperature Cycling (TC) Air to Air
Temperature Cycling on Board (TCOB)
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Thermal Shock ( TS )
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Convection Reflow
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High Temperature Storage (HTS)
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Low Temperature Storage
( LTS ) -
Temperature, Bias and Operating Life (OPLT)
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Drop Test
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ESD – HBM / MM
Latch-Up
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ESD CDM
Moisture Sensitivity Level Soaking (MSL)
Test:
Moisture Sensitivity Level Soaking (MSL)
Condition:
IPC/JEDEC J-STD-020 JESD22-113
– 85ºC / 85%RH
– 85ºC / 60%RH
– 60ºC / 60%RH
– 30ºC / 60%RH
Other test conditions are available upon request
Application:
To establish an industrial standard pre-conditioning flow for non-hermetic SMDs that is sensitive to moisture induced stress so that devices can be properly packaged, stored and handled to avoid damage during typical industry multiple solder reflow / repair operations
Temperature Humidity Bias Life Test (THB)
Test:
Temperature Humidity Bias Life Test (THB)
Condition:
JESD22-A101
– 85ºC / 85%RH with Bias
Application:
To check resistance of non-hermetic packages to long time operation in an environment with high relative humidity and voltage biasing
Highly Accelerated Stress Test (HAST)
Test:
Highly Accelerated Stress Test (HAST)
Condition:
JESD22-A110
– 110°C/ 85%RH
– 130°C/ 85%RH with Bias
Application:
To check the integrity of non-hermetic packages when exposed to a high temperature and relative humidity environment with voltage biasing
Unbiased HAST (uHAST)
Test:
Unbiased HAST (uHAST)
Condition:
JESDZ22-A118
– 110°C/ 85%RH
– 130°C/ 85%RH
Application:
To check the integrity of non-hermetic packages when exposed to high temperature and relative humidity environment
Autoclave (PCT)
Test:
Autoclave (PCT)
Condition:
JESD22-A102
– 121°C/ 100%RH
Application:
To check the integrity of non-hermetic packages when exposed to high temperature and saturated humidity environment
Temperature Cycling (TC)
Test:
Temperature Cycling (TC) Air to Air
Condition:
JESD22-A104; Standard Conditions
– -55ºC / 125ºC
– -65ºC / 150ºC 2 cycles per hour
Other test conditions and soak mode are available upon request
Application:
To check ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes
Failure Mechanism: die crack, package crack, wire bond failure, solder fatigue
Temperature Cycling on Board (TCOB)
Test:
Temperature Cycling on Board (TCOB)
Condition:
IPC-9701
– -40 °C/125°C 1 cycle per hour
Other test conditions and soak mode are available upon request
Application:
Temperature Cycling with continuous resistance monitoring to check solder-joint reliability due to cyclic change in temperature
Thermal Shock ( TS )
Test:
Thermal Shock ( TS )
Condition:
JESD22-A106
– -55ºC / 125ºC
– -65ºC / 150ºC
Application:
To check ability of components to withstand sudden exposure to extreme changes in temperatures and to the effect of alternate exposures to these extremes
Convection Reflow
Test:
Convection Reflow
Condition:
IPC/JEDEC J-STD-020 JESD22-113
– 220ºC
– 235ºC
– 245ºC
– 250ºC
– 260ºC
Application:
To simulate typical industry multiple solder reflow / repair operations during SMT
High Temperature Storage (HTS)
Test:
High Temperature Storage (HTS)
Condition:
JESD22-A103
– 125ºC
– 150ºC
– 175ºC
– 200ºC
Application:
To check the effect of time and temperature under storage conditions. For thermally activated failure mechanisms
Low Temperature Storage ( LTS )
Test:
Low Temperature Storage ( LTS )
Condition:
JESD22-A119
– -40ºC
– -55ºC
– -65ºC
Application:
To check the effect of time and temperature under storage conditions. For thermally activated failure mechanisms
Temperature, Bias and Operating Life (OPLT)
Test:
Temperature, Bias and Operating Life (OPLT)
Condition:
JESD22-A108
– 125ºC or per customer specification
Application:
To check the effects of bias and temperature conditions over time. To simulate device under operating conditions in an accelerated manner
Drop Test
Test:
Drop Test
Condition:
JESD22-B111
– 1500G, 0.5msec
– 2900G, 0.3msec
Daisy chain set-up for continuous open/short measurement
Other test conditions are available upon request
Application:
To check package and package to board interconnect reliability under mechanical shock.
This test is designed for portable electronics application
ESD - HBM / MM
Test:
ESD – HBM / MM
Condition:
– JESD22-A114 (HDB) [100pF / 1.5K ohm]
– JESD22-A115 (MM)
Require ESD board /pkg
Application:
To classify micro-circuits accordingly to their susceptibility to damage or degradation by exposure to electrostatic discharge
Latch-Up
Test:
Latch-Up
Condition:
JESD78 Or per customer specification
Application:
To determine the level of susceptibility to damage from current or voltage induced latch-up in a micro-circuit
ESD CDM
Test:
ESD CDM
Condition:
JESD22-C101
Required CDM board /pkg
Application:
To classify microcircuits accordingly to their susceptibility to damage or degradation by exposure to electrostatic discharge