We integrate our service offerings to provide customers full-turnkey manufacturing solutions, including: bumping, wafer probe, wafer processing, assembly, test, black-box encryption and direct shipment as designated by our customers.
Full turnkey solutions, including bumping, wafer probing, wafer processing, assembly, testing and the direct shipment of semiconductors to users designated by our customers.
Full range of IC packages and smart card module assembly, and smart card inlay.
Package Design and Package Engineering
Bump mask design
Test Engineering and Test Development
Reliability and Failure Analysis Engineering
Strategic Supply Chain Partners
Click any of the Strategic Supply Chain Partners on the bottom left to learn more.
UTAC established joint marketing and supply chain agreement with leading supplier of embedded 3D chip technology. Starting at the design phase, we co-design the substrate and package to align with customer spec and manage the entire process from design to final test.
April 2015 – Joint marketing and supply chain agreement Between AT&S and UTAC for 3D SiP with embedded chip technology was established.
UTAC works with local burn-in companies to provide complete seamless burn-in services in support of the customers that still require burn-in for their products.