SMTA, South East Asia Technical Conference (Technical Paper)

16 Apr 2015

Technical Paper – “Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group’s Grid Array Package (GQFN) and its Board Level Reliability”

Author: Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn and Saravuth Sirinorakul

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